Imprint Molding Gas Supply Dynamics for Foreign Substance Control

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Solution Overview

Problem

In imprint apparatuses, foreign substances attached to molds or substrates can cause deformation of the mold or defects in the composition formed on the substrate, especially when gas flows are involved in the process.

Innovation Solution

A molding apparatus with a conveying unit, a holding unit, a supply unit for gas, and a control unit that adjusts the gas supply rate differently based on whether the conveying unit is inside or outside the object space, to prevent foreign substances from being scattered and attached to the mold or substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If gas is supplied to the space between substrate and mold to reduce defects, then purity of the space is improved, but foreign substances can be scattered and attached to the mold or substrate

Engineering Contradiction:
Improvepurity of space between substrate and moldVSAvoidforeign substance attachment to mold or substrate
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The gas supply amount is dynamically adjusted based on the position of the conveying unit. When the conveying unit is inside the object space, the gas supply amount is set to a first value; when outside, it is set to a second value. This dynamic adjustment prevents foreign substances from being scattered while maintaining space purity during critical operations.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The control unit monitors the position of the conveying unit and adjusts the gas supply amount accordingly. This feedback mechanism ensures that gas flow conditions are optimized to prevent foreign substance scattering while maintaining the purity of the object space, resolving the contradiction between these two requirements.

Inventive Principle:
Principle #23Feedback

2Productivity

If conveying unit enters the object space to convey substrate or mold, then productivity is improved, but air flow can hit the conveying unit and scatter foreign substances

Engineering Contradiction:
Improveconveying efficiency of substrate or moldVSAvoidscattered foreign substances from air flow
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The system dynamically adjusts gas supply based on whether the conveying unit is inside or outside the object space. This allows the conveying unit to move freely within the space for efficient productivity while the gas supply is controlled to prevent foreign substance scattering during these movements.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The gas supply parameter is changed based on the operational state of the conveying unit. By switching between first and second supply amounts depending on the conveying unit's position, the system enables efficient conveying operations while preventing the harmful effect of foreign substance scattering.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively prevents foreign substances from being attached to the mold or substrate, thereby reducing the risk of mold deformation and composition defects during the imprint process.

Implementation Method 1

gas having the effect of reducing a defect is supplied to the space to form a first air flow

Methodology Applied
Scientific EffectGas flow: Convection

Data Source

PatentUS12332562B2Molding apparatus for molding composition on substrate using mold, molding method, and method for manufacturing article
Publication Date: 2025.06.17 CANON KK
  • US12332562B2 patent drawing
  • US12332562B2 patent drawing
  • US12332562B2 patent drawing

AI summary

A molding apparatus for molding a composition on a substrate using a mold includes a conveying unit configured to convey an object, a holding unit configured to hold the object conveyed by the conveying unit, a supply unit configured to supply gas to an object space surrounding the object held by the holding unit, and a control unit configured to control the supply unit so that a first amount of supply per unit time of the gas to be supplied from the supply unit in a case where the conveying unit is inside the object space is different from a second amount of supply per unit time of the gas to be supplied from the supply unit in a case where the conveying unit is outside the object space.