Imprint Molding Shearing Force Measurement and Base Layer Control
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Solution Overview
Problem
Existing imprint methods face accuracy issues due to shearing forces caused by viscoelasticity during position adjustment between a substrate and a mold, leading to distortion and varying results across different areas of the substrate, especially when the base layer thickness is uneven or particles are present.
Innovation Solution
A molding method that measures the in-plane distribution of shearing force and film thickness of the base layer, adjusting application conditions to balance and uniformize these distributions, thereby improving position adjustment accuracy and preventing mold damage from particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If position adjustment is made between substrate and mold during imprint, then alignment is achieved, but shearing force causes distortion and decreases position adjustment accuracy
Solution Approach 1:
The patent applies parameter changes by irradiating light to the imprint material to alter its viscosity characteristics. This changes the material's physical state from a high-viscosity state that generates large shearing forces to a lower-viscosity state that reduces shearing forces during position adjustment, thereby resolving the contradiction between achieving alignment and avoiding distortion
Solution Approach 2:
The patent employs periodic action through controlled light irradiation timing. Light is irradiated at specific periods: before position adjustment to reduce viscosity and shearing force, and after position adjustment to restore viscosity for pattern release. This periodic modification of material properties enables both accurate alignment and successful pattern transfer
2Measurement precision
If light is emitted to reduce viscosity and shearing force, then position adjustment accuracy improves, but pattern release may be affected
Solution Approach 1:
The patent uses periodic light irradiation with two distinct phases: first irradiation before position adjustment reduces viscosity for accurate alignment, and second irradiation after position adjustment restores viscosity for reliable pattern release. This time-separated periodic action resolves the contradiction between improving position accuracy and maintaining pattern release reliability
Solution Approach 2:
The patent applies preliminary action by irradiating light before position adjustment to pre-condition the imprint material. This preliminary light exposure reduces viscosity in advance, enabling accurate position adjustment without affecting subsequent pattern release, as the material is re-solidified after alignment is complete
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the accuracy of position adjustment between the substrate and mold across the entire surface, reduces distortion, and prevents mold damage by optimizing base layer conditions and particle detection sensitivity based on film thickness measurements.
Implementation Method 1
In the position adjustment between the substrate and the mold, the substrate and the mold are moved relative to each other, whereby a force acts in a direction opposite to the relative moving direction of the substrate and the mold due to viscoelasticity of the imprint material.
Implementation Method 2
Then, light (ultraviolet light) is emitted to the imprint material in the state where the imprint material and the mold are in contact with each other (a curing step), thereby curing the imprint material.
Data Source
AI summary
An imprint method brings a mold into contact with an imprint material placed on a base layer on a substrate and cures the imprint material, thereby obtaining a cured product onto which a shape of the mold is transferred. The imprint method includes making position adjustment of the mold and the substrate in a state where the mold and the base layer of the substrate are in contact with the imprint material, measuring an in-plane distribution of a shearing force generated when the position adjustment is made, and determining an application condition of the base layer based on a result of the measurement.


