Imprint Apparatus Resin Dispensing for Bubble-Free Contoured Patterns
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Solution Overview
Problem
In imprint technology, low-viscosity resins used for micronization of semiconductor devices and other microfabrication processes often trap bubbles when applied using inkjet methods, leading to unfilled portions in the resin pattern due to uneven resin distribution and increased throughput challenges.
Innovation Solution
An imprint apparatus that adjusts the application positions of resin drops based on the principal axis direction of the contoured mold pattern, with dispenser settings ensuring larger gaps in the principal axis direction and shorter gaps perpendicular to it, to enhance resin filling and reduce bubble entrapment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If resin is applied using inkjet method for each shot, then resin can be applied to low-viscosity requirements for fine patterns, but bubbles easily become trapped in the uncured resin between mold and substrate
Solution Approach 1:
The patent applies resin to multiple shots simultaneously before mold pressing, rather than applying resin immediately before each pressing operation. This preliminary application allows the resin to be distributed across multiple target areas in advance, reducing the time for bubble formation during the actual pressing operation while ensuring adequate resin coverage for fine pattern filling.
Solution Approach 2:
The patent changes from sequential single-shot resin application to multi-shot simultaneous resin application, adding a spatial dimension to the resin application process. By applying resin to multiple shots at once, the system optimizes both the filling of fine contours and the reduction of bubble entrapment through improved resin distribution across the substrate area.
2Reliability
If amount of resin drops is increased at locations where bubbles remain, then unfilled portions are suppressed, but evenness of remaining film thickness after imprint is affected
Solution Approach 1:
The patent implements location-specific resin application by determining distinct application positions for each shot based on contour pattern characteristics. Instead of uniformly increasing resin amount across all shots, the system selectively applies resin to specific locations where bubble entrapment is likely to occur, maintaining film thickness uniformity in areas that do not require additional resin while ensuring adequate filling in critical areas.
Solution Approach 2:
The patent dynamically adjusts resin application parameters (position and amount) based on the specific contour pattern of each shot. By analyzing the contour pattern and determining optimal application positions, the system varies resin application parameters locally to suppress unfilled portions without compromising overall film thickness uniformity, rather than applying a fixed increase in resin amount everywhere.
3Productivity
If resin is applied in advance to all shots on substrate, then throughput is improved, but this becomes difficult when resin has low viscosity
Solution Approach 1:
The patent segments the resin application process by applying resin to multiple discrete shots simultaneously rather than to the entire substrate at once. This segmentation approach allows the low-viscosity resin to be applied to controlled, localized areas where it can be properly positioned before mold pressing, while still achieving improved throughput by processing multiple shots in parallel rather than sequentially.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses unfilled portions in the contoured pattern and increases throughput by optimizing resin distribution and curing efficiency, maintaining even film thickness and productivity.
Implementation Method 1
an ultraviolet light-cured resin (imprint material, photo-cured resin) is applied to a shot, which is an imprint area on a substrate (wafer). Next, this resin (photo-cured resin) is molded by using a mold. In addition, by separating the resin after curing the resin by irradiating ultraviolet light, a resin pattern is formed on the substrate.
Data Source
AI summary
Provided is an imprint apparatus that applies a resin to several locations on a substrate, brings the resin and a mold into contact, and transfers a contoured pattern formed in the mold to the resin, comprising: a controller that sets a principal axis direction according to the contoured pattern and determines the application positions of the resin based on the principal axis direction that has been set such that the distances between resin drops that have been applied so as to be separated in the principal axis direction is larger than the distances between resin drops that have been applied so as to be separated in a direction that is perpendicular to the principal axis direction; and a dispenser that applies the resin based on the application position that has been determined.