Imprint Apparatus Scanning Alignment Feedback
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Solution Overview
Problem
Existing imprint techniques face challenges in maintaining accurate alignment between a mold and a substrate during ultraviolet light irradiation, leading to pattern transfer errors due to relative displacement, which is not addressed in previous patents like Japanese Patent Laid-Open Nos. 2003-163158 and 2007-280993.
Innovation Solution
An imprint apparatus equipped with a measurement unit to detect the relative positions of the mold and substrate, a light source unit for curing, and a control unit that aligns the mold and substrate during the scanning process, ensuring precise alignment and reducing displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact light source formed by light emitting devices is used for scanning irradiation, then the light source size is reduced and scanning capability is improved, but relative displacement between mold and substrate occurs during exposure, causing overlay accuracy degradation
Solution Approach 1:
The patent employs a feedback mechanism where the actual positions of the mold and substrate are measured during the scanning exposure process, and this measurement information is used to correct overlay errors. The control unit receives position data from measurement units and adjusts the exposure process accordingly, ensuring high overlay accuracy is maintained despite the scanning motion of the compact light source.
Solution Approach 2:
The patent replaces mechanical alignment methods with optical measurement and computational correction. Instead of relying on mechanical precision of the scanning system, the invention uses optical measurement units to detect positions and computational algorithms to calculate and apply corrections, achieving high overlay accuracy through a non-mechanical approach.
2Productivity
If scanning irradiation is performed over a wide substrate area, then productivity is improved, but relative displacement between mold and substrate increases, causing pattern transfer errors
Solution Approach 1:
The patent uses real-time feedback from measurement units that continuously monitor the relative positions of mold and substrate during scanning exposure. This feedback enables dynamic correction of overlay errors that occur during wide-area exposure, maintaining pattern transfer accuracy across the entire substrate area while achieving high productivity through scanning irradiation.
Solution Approach 2:
The patent implements a dynamic correction system that adapts to changing conditions during the exposure process. As the compact light source scans across the substrate, the system continuously measures position changes and dynamically adjusts exposure parameters to compensate for relative displacement, enabling accurate pattern transfer over wide areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively maintains high overlay accuracy and reduces pattern transfer errors by aligning the mold and substrate based on real-time measurements, ensuring consistent and accurate pattern transfer across the substrate surface.
Implementation Method 1
a measurement unit configured to measure relative positions of the mold and the substrate
Implementation Method 2
a light source unit configured to emit light for curing the imprint material
Data Source
AI summary
The present invention provides an imprint apparatus which performs an imprint process of forming a pattern on a substrate by molding an imprint material on the substrate using a mold, the apparatus including a measurement unit configured to measure relative positions of the mold and the substrate, a light source unit configured to emit light for curing the imprint material, a scanning unit configured to scan light from the light source unit on the substrate, and a control unit configured to control the imprint process, wherein the control unit performs the imprint process by causing the scanning unit to scan the light while partially aligning the mold and the substrate with each other based on a measurement result of the measurement unit.