Imprint Apparatus Thermal Correction via Scanning Heating
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Solution Overview
Problem
Existing imprint apparatuses require complex and costly optical systems to provide temperature distribution for shape correction of substrate and mold patterns, leading to increased difficulty and cost in achieving accurate superposition of multi-layer patterns during microfabrication processes.
Innovation Solution
An imprint apparatus with a correction unit that includes a heating unit for localized heating of the substrate or mold, a scanning unit to adjust the heating region, and a control unit to manage the heating and scanning based on deformation information, allowing for precise thermal correction of pattern shapes without the need for extensive optical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If temperature distribution is provided to the pattern region by collectively irradiating the entire surface with light, then shape correction of the pattern region can be achieved, but a complex optical system is needed resulting in increased cost and design difficulty
Solution Approach 1:
The patent divides the heating process into multiple segments by using a heating unit with a smaller heating region that scans across the pattern region. Instead of using a complex optical system to heat the entire surface at once, the heating region is segmented and moved to different positions to progressively heat the entire pattern region, thereby simplifying the optical system while maintaining correction accuracy
Solution Approach 2:
The patent introduces dynamic scanning motion of the heating region across the pattern region. The heating unit is moved by a scanning mechanism to dynamically change its position relative to the pattern region, allowing the same simple heating unit to effectively heat the entire area over time, avoiding the need for a complex static optical system
2Temperature
If a complex optical system is used to guide light to the pattern region for shape correction, then temperature distribution can be achieved, but cost and design difficulty increase
Solution Approach 1:
The patent extracts the essential function of heating from the complex optical system by using a dedicated heating unit with a smaller heating region. The scanning mechanism is introduced to compensate for the smaller size, allowing the system to achieve the required temperature distribution without needing complex optical guidance, thereby simplifying manufacturing and design
Solution Approach 2:
The patent replaces complex optical guidance mechanisms with a mechanical scanning system. Instead of using complex optics to direct light to specific locations, a simpler mechanical scanning mechanism moves the heating region across the pattern region, achieving the same temperature distribution effect with easier-to-manufacture components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the thermal correction mechanism, reducing costs and complexity while maintaining high accuracy in matching substrate and mold patterns, thereby improving the superposition accuracy of multi-layer patterns during microfabrication.
Implementation Method 1
a heating unit configured to heat an object corresponding to the target region of either the mold or the substrate in a heating region having an area smaller than that of the pattern region on the mold
Data Source
AI summary
An imprint apparatus forms a pattern of a resin on a region to be processed of a substrate using a mold including a pattern region on which a pattern is formed and includes a correction unit configured to correct a shape of a target region that is either the pattern region on the mold or the region to be processed on the substrate, wherein the correction unit further includes: a heating unit configured to heat an object corresponding to the target region of either the mold or the substrate in a heating region having an area smaller than that of the pattern region on the mold; a scanning unit configured to scan the heating region with respect to the target region by changing the relative position of the target region and the heating region; and a control unit configured to acquire information regarding a correction deformation amount of the target region and control the heating unit and the scanning unit based on the information.