Imprint Apparatus Shearing Force Detection for Overlay Precision
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Solution Overview
Problem
In the imprint process for semiconductor devices, the alignment of mold and substrate patterns is challenged by shearing forces generated due to viscoelastic properties of the resin and potential foreign particles, leading to decreased overlay precision and pattern deformation.
Innovation Solution
An imprint apparatus equipped with a detector to measure shearing forces on the mold and substrate during alignment, and a controller to adjust the imprint process based on these measurements, ensuring precise alignment and minimizing shearing force impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the mold and substrate are aligned while the imprint material is between them, then the alignment precision can be improved, but shearing force is generated due to viscoelastic properties of the resin, causing pattern deformation and decreasing overlay precision
Solution Approach 1:
The patent applies preliminary action by performing alignment before the imprint material is fully set, using a state where the imprint material has not yet exhibited strong viscoelastic properties. This timing strategy allows alignment to be completed before shearing forces become significant, thus achieving both good alignment precision and maintaining overlay precision.
Solution Approach 2:
The patent utilizes parameter changes by controlling the temperature and time conditions of the imprint material during alignment. By maintaining the imprint material at a temperature and time state where viscoelastic effects are minimized, the system achieves accurate alignment without generating harmful shearing forces that would deform the pattern.
2Length of moving object
If the thickness of the resin is reduced to several tens of nanometers or less, then the etching process in later steps can be improved, but the resin undergoes structuration and exhibits high viscoelastic properties, generating shearing force during alignment
Solution Approach 1:
The patent applies preliminary action by completing the alignment process before the thin resin layer develops significant viscoelastic properties. By timing the alignment to occur when the resin is still in a more compliant state, the system achieves accurate alignment without generating shearing forces that would deform the pattern, even with resin thicknesses of several tens of nanometers or less.
Solution Approach 2:
The patent utilizes parameter changes by controlling the temperature and molecular state of the resin to prevent structuration during alignment. By maintaining parameters that keep the resin in a less viscoelastic state during the alignment process, the system enables thin resin layers to be used without suffering from high shearing forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances overlay precision by controlling the imprint process to manage shearing forces, thereby improving pattern alignment and reducing deformation, leading to higher-quality semiconductor devices with improved throughput and economic efficiency.
Implementation Method 1
a detector configured to detect a shearing force generated in at least one of the mold and the substrate
Implementation Method 2
a force corresponding to the viscoelasticity of the resin is applied to the mold and the substrate in a shearing direction
Data Source
AI summary
The present invention provides an imprint apparatus which performs an imprint process of molding an imprint material on a substrate with a mold and forming a pattern on the substrate, the apparatus including a detector configured to detect a shearing force generated in at least one of the mold and the substrate in a case where a pattern of the mold and a region of the substrate are aligned with each other with the imprint material on the substrate and the mold being in contact with each other, and a controller configured to control the imprint process based on the detected shearing force.