Imprint Irradiation Strategy for Skip-Region Alignment Accuracy
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Solution Overview
Problem
Existing imprint methods face challenges in maintaining overlapping accuracy between circuit patterns due to the influence of temperature changes caused by light curing, especially when foreign particles or skip regions are present, leading to potential damage and misalignment.
Innovation Solution
An imprint method that includes a contact step, a first irradiation step using ultraviolet light, a demolding step, and a second irradiation step using non-curing light for skip regions to maintain alignment accuracy by minimizing thermal effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a region which is not subjected to imprint process (skip region) exists on the substrate, then productivity is improved by avoiding unnecessary processing, but overlapping accuracy deteriorates due to temperature influence changes from light curing
Solution Approach 1:
The patent applies different irradiation strategies to different regions: imprint regions receive full curing light irradiation while skip regions receive no irradiation or reduced irradiation. This local differentiation allows the system to maintain high overlapping accuracy in imprint regions while improving productivity by skipping unnecessary processing in regions where patterns are already present or not required.
Solution Approach 2:
The patent determines skip regions in advance based on foreign particle detection and pattern overlap analysis before the imprint process begins. By pre-identifying regions that do not require imprint processing, the system can avoid unnecessary light irradiation and maintaining thermal stability, thus preserving overlapping accuracy while improving efficiency.
2Ease of manufacture
If light is used to cure the imprint material, then the imprinting process can be completed, but temperature changes occur which affect overlapping accuracy
Solution Approach 1:
The patent implements spatially selective light irradiation where only imprint regions receive full curing light exposure while skip regions receive minimal or no irradiation. This localized approach enables efficient curing where needed while minimizing thermal effects that would compromise overlapping accuracy in adjacent regions.
Solution Approach 2:
The system uses foreign particle detection and real-time monitoring to dynamically determine which regions should be processed and which should be skipped. This feedback mechanism allows the system to adapt the light irradiation pattern, curing only regions that require it while preserving thermal stability and overlapping accuracy in regions where patterns already exist or are not needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures stable overlapping accuracy by compensating for thermal deformations in skip regions, reducing the risk of pattern damage and improving alignment precision in semiconductor device production.
Implementation Method 1
a first irradiation step of irradiating the imprint material on the substrate with first light for curing the imprint material while the mould and the imprint material on the substrate are in contact with each other
Implementation Method 2
a second irradiation step of irradiating, other than an imprint region in which an imprint process including the contact step, the first irradiation step, and the demolding step is performed, a skip region that is a region in which the imprint process is skipped with second light if the skip region exists on the substrate
Data Source
AI summary
Provided is an imprint method which includes: a contact step of bringing a mould into contact with an imprint material on a substrate; a first irradiation step of irradiating the imprint material on the substrate with first light for curing the imprint material while the mould and the imprint material on the substrate are in contact with each other; a demolding step of separating the mould from the imprint material on the substrate; and a second irradiation step of irradiating, other than an imprint region in which an imprint process including the contact step, the first irradiation step, and the demolding step is performed, a skip region that is a region in which the imprint process is skipped with second light if the skip region exists on the substrate.