Imprint Apparatus Substrate Deformation for Overlay Accuracy
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Solution Overview
Problem
Nanoimprint technologies face challenges in achieving accurate magnification correction and overlay precision due to variable wafer magnification and distortion issues, particularly in semiconductor lithography, where conventional methods like projection optical systems are absent, and physical deformation of molds leads to pattern distortion and reduced overlay accuracy.
Innovation Solution
An imprint apparatus with a mold holding unit, substrate holding unit, and control unit that adjusts the spacing between the mold and substrate based on shape difference information, using a combination of driving mechanisms for precise alignment and deformation to correct magnification and distortion, ensuring optimal contact and pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a magnification correction mechanism is used to physically deform the mold, then overlay accuracy is improved, but pattern distortion occurs due to Z-direction deformation
Solution Approach 1:
Instead of deforming the mold to correct magnification (which causes Z-direction deformation and pattern distortion), the invention inverts the approach by deforming the substrate in the opposite direction. The substrate deformation unit applies forces to the substrate to create counter-deformation that compensates for the mold's X-Y plane deformation, thereby correcting overlay accuracy without introducing pattern distortion.
Solution Approach 2:
The invention introduces a substrate deformation unit as an intermediary mechanism between the mold and the final pattern transfer. This unit acts as a mediator that compensates for magnification errors by deforming the substrate, thereby preventing the need for direct mold deformation that would cause pattern distortion.
2Manufacturing precision
If the mold is physically deformed to correct magnification, then overlay accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The invention inverts the conventional approach by placing the deformation mechanism on the substrate side rather than the mold side. This substitution maintains the ability to correct magnification while simplifying the overall system architecture, as substrate deformation can be achieved through more straightforward actuation mechanisms.
3Manufacturing precision
If the spacing between mold and substrate is reduced for better contact, then pattern transfer precision is improved, but pattern distortion increases due to mold deformation
Solution Approach 1:
Instead of reducing spacing to compensate for mold deformation (which exacerbates pattern distortion), the invention inverts the approach by deforming the substrate to counteract the mold's deformation. This allows maintaining optimal spacing for pattern transfer precision while eliminating the pattern distortion through counter-deformation of the substrate.
Data Source
AI summary
An imprint apparatus that molds an imprint material on a substrate using a mold, and forms a pattern on the substrate, the imprint apparatus includes a mold holding unit configured to hold the mold, which includes a surface including a pattern area, a substrate holding unit configured to hold the substrate, a first acquisition unit configured to acquire information concerning a difference in shape between the pattern area and a shot already formed on the substrate, and a control unit configured to control at least one of the mold holding unit and the substrate holding unit to adjust a spacing between the mold and the substrate, based on the information concerning the difference in shape acquired by the first acquisition unit, in a state where the pattern area and the imprint material are in contact with each other.