Imprint Apparatus Substrate Heating for Deformation Correction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing imprint apparatuses can only correct magnification components between a substrate and a mold, failing to accurately transfer patterns due to deformations such as trapezoid and barrel components in the shot region of the substrate during semiconductor device manufacturing.
Innovation Solution
An imprint apparatus with a heating unit that deforms the shot region of the substrate by applying targeted heat to specific portions, using a control unit to generate a heating profile that aligns the shape of the shot region with the target shape, ensuring accurate pattern transfer by correcting for various deformation components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the temperature of the substrate and mold is controlled as a whole to correct magnification component, then magnification correction between substrate and mold is achieved, but other deformation components (trapezoid, barrel) in the shot region cannot be corrected
Solution Approach 1:
The substrate heating is divided into multiple independent heating regions corresponding to different deformation components. Each region can be heated independently to correct specific deformations (magnification, trapezoid, barrel components) separately, allowing comprehensive correction of various deformation types without interfering with each other.
Solution Approach 2:
Different regions of the substrate are assigned different heating characteristics based on their specific deformation needs. The shot region receives localized heating with specific heat quantities and time profiles tailored to correct local deformation components, while other regions are heated differently or not at all, achieving precise local correction.
2Manufacturing precision
If the shot region is heated to correct shape deformations, then overlay accuracy is improved, but the heating process becomes more complex
Solution Approach 1:
The heating profiles and heat quantities for each region are calculated and prepared in advance based on the detected deformation components. The control unit stores multiple heating profiles corresponding to different deformation types and combines them to generate the final heating control signals, simplifying the real-time control process.
Solution Approach 2:
The system detects the actual shape of the shot region, compares it with the target shape, and uses the difference to determine the required heating. The control unit calculates the necessary heat quantities and time profiles based on this feedback, automatically adjusting the heating process to achieve the desired correction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively corrects shape deformations in the shot region, allowing for precise pattern transfer from the mold to the substrate, improving overlay accuracy and productivity in semiconductor device manufacturing.
Implementation Method 1
a heating unit configured to deform a shape of the shot region by heating each of a plurality of portions of the substrate
Data Source
AI summary
The present invention provides an imprint apparatus for transferring a pattern of a mold to a shot region on a substrate by curing an imprint material on the substrate while the mold and the imprint material are in contact with each other, comprising a heating unit configured to deform a shape of the shot region by heating each of a plurality of portions of the substrate, and a control unit configured to obtain a target heat quantity in each of the plurality of portions so that the shape of the shot region becomes closer to a target shape, generate a heating profile for each of the plurality of portions so that a heat quantity in the portion becomes equal to the target heat quantity, and control the heating unit to heat each of the plurality of portions according to the generated heating profile.