Imprint Device Substrate Positioning Correction
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Solution Overview
Problem
Existing imprint technologies face challenges in reducing positional deviation between substrates and substrate holding units, leading to increased tilting of patterns during mold release, as existing correction methods only adjust the substrate stage based on measured deviations without addressing the underlying positional mismatch.
Innovation Solution
An imprint device with a substrate holding unit that uses a suction unit with adjustable partial areas, a moving unit for precise alignment, an acquisition unit for measuring positional relationships, and a processor unit to calculate and apply corrections for positional deviations between the substrate and the holding unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the substrate stage is corrected based on measured positional deviation, then the driving amount of the substrate stage is adjusted, but the actual positional deviation between the substrate and substrate chuck remains unreduced
Solution Approach 1:
The system uses a microscope to detect the actual position of the substrate and feeds this information back to the control unit. The control unit then adjusts the driving amount of the substrate stage based on this feedback to reduce positional deviation. This closed-loop feedback mechanism ensures that the substrate is accurately positioned relative to the substrate chuck, resolving the contradiction between measurement and manufacturing precision.
Solution Approach 2:
The patent replaces purely mechanical positioning with a combination of optical detection (microscope) and controlled mechanical adjustment (substrate stage). By using optical fields to detect position and electronically controlling the mechanical stage movement, the system achieves higher positioning accuracy than mechanical methods alone could provide.
2Manufacturing precision
If the suction force of the suction area corresponding to the shot area is weakened for mold release, then the pattern tilting is reduced, but positional deviation between the substrate and substrate chuck increases
Solution Approach 1:
The system performs preliminary detection of the substrate position using a microscope before the mold release process. Based on this detection, the control unit pre-adjusts the substrate stage position to compensate for expected deviations. This preliminary action ensures that even when suction force is weakened during mold release, the substrate remains properly aligned, preventing both pattern tilting and positional deviation.
Solution Approach 2:
The system dynamically changes the suction force parameter during the imprinting process. The suction force is adjusted based on the processing stage: stronger suction during imprinting to maintain position, and weakened suction during mold release to facilitate pattern release. This parameter change is coordinated with substrate stage adjustments to maintain alignment throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces positional deviation and tilting of patterns by enabling precise alignment and correction of the substrate with respect to the substrate holding unit, improving the accuracy and quality of pattern formation.
Implementation Method 1
a substrate holding unit that holds the substrate with a suction unit
Data Source
AI summary
An imprint device that forms a pattern by having the imprint material on a substrate and a mold come in contact with each other, the imprint device including a substrate holding unit that holds the substrate with a suction unit including partial areas, a moving unit including the substrate holding unit, a mold release being performed while a suction force of a partial area corresponding to an area in which the pattern is formed is set weaker than a suction force of other partial areas, an acquisition unit acquiring measurement data indicating a positional relationship between the substrate and the substrate holding unit, a target of the measurement data including an end portion of the substrate and the substrate holding unit, and a processor unit obtaining a correction amount to correct a positional deviation of the substrate with respect to the substrate holding unit using the acquired measurement data.