Imprint Apparatus Substrate Warpage Correction via Segmented Pressure Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing imprint technologies face challenges in achieving high overlay accuracy due to substrate warpage caused by film distortion during multi-layered circuit pattern formation, which current correction methods are inadequate in addressing, especially for higher-order distortions.
Innovation Solution
An imprint apparatus with a substrate holding unit having multiple pressure-controlled regions and a control unit that adjusts pressure based on substrate shape and distortion information to correct warpage during the curing process, ensuring precise alignment and pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple actuators are installed on the side face of the mold to correct pattern shape, then low-order distortion correction is improved, but the ability to correct higher-order distortion attributable to substrate warpage remains insufficient
Solution Approach 1:
The substrate holding unit is divided into multiple independently controllable holding regions (first, second, third, and fourth holding regions) that can apply different pressures to different areas of the substrate. This segmentation enables localized pressure control to correct higher-order distortions caused by substrate warpage, extending beyond the capabilities of conventional side-face actuator systems.
Solution Approach 2:
The invention transitions from correcting pattern shape only in the lateral dimension (via side-face actuators) to adding vertical dimension control through independent pressure control of multiple holding regions. This dimensional expansion enables correction of substrate warpage-induced higher-order distortions that cannot be addressed by lateral actuators alone.
2Ease of manufacture
If substrate warpage is not corrected, then the process is simple, but overlay accuracy deteriorates due to distorted transfer area shape
Solution Approach 1:
The system performs preliminary measurement of substrate shape and distortion before the imprint process, then pre-adjusts the pressure distribution in the holding regions to compensate for anticipated warpage effects. This preliminary correction ensures that the substrate maintains proper flatness during pattern transfer, achieving high overlay accuracy without complex real-time intervention.
Solution Approach 2:
The system incorporates measurement of substrate shape and distortion information, using this feedback to dynamically control the pressure distribution in the holding regions. This closed-loop control enables automatic compensation for substrate warpage, maintaining high overlay accuracy while managing process complexity through intelligent control algorithms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves overlay accuracy by effectively managing substrate warpage through controlled pressure adjustments, enhancing the precision of pattern transfer on substrates with complex distortions.
Implementation Method 1
a substrate holding unit having a plurality of holding regions that holds the substrate, and a control unit configured to control a pressure of the plurality of holding regions
Data Source
AI summary
An imprint apparatus that cures an imprint material on a substrate in a state where a mold is in contact with the imprint material includes a substrate holding unit having a plurality of holding regions that holds the substrate, and a control unit configured to control a pressure in each of the holding regions independently, wherein the control unit controls the pressure based on at least one of shape information and distortion information of the substrate, at least when the imprint material is cured.