Imprint Alignment Using Substrate Temperature for Magnification Error
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Solution Overview
Problem
In semiconductor manufacturing, pattern sizes of templates often mismatch the sizes of shot regions due to manufacturing errors, leading to excessive or deficient relative ratios that increase overlapping errors of patterns on substrates.
Innovation Solution
An imprint apparatus with a temperature control unit and a template stage that adjusts the temperature of the substrate and relative position to correct magnification errors, using image sensors for alignment and pressing members to match pattern sizes with shot region sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pressing members are used to correct pattern ratios, then manufacturing precision improves, but the correction capability is limited when pattern sizes and shot region sizes exceed the correctable range
Solution Approach 1:
The patent changes the physical state of the substrate by controlling temperature to adjust its dimensions. The temperature control unit heats or cools the substrate to expand or contract it, thereby adjusting the shot region size to match the template pattern size. This resolves the limitation of pressing members by introducing a new parameter (temperature) that can correct magnification errors beyond the mechanical correction range.
Solution Approach 2:
The patent replaces the purely mechanical correction system (pressing members) with a hybrid system that incorporates thermal control. Instead of relying solely on mechanical pressure to adjust pattern ratios, the system uses temperature-controlled substrate expansion/contraction to achieve magnification correction, thereby extending the correctable range beyond mechanical limitations.
2Manufacturing precision
If temperature control is applied to adjust substrate dimensions, then magnification error correction improves, but device complexity increases
Solution Approach 1:
The temperature control unit serves multiple functions: it not only corrects magnification errors by adjusting substrate dimensions but also maintains substrate temperature stability during the imprint process. This multi-functionality justifies the added device complexity by providing both correction and process control capabilities in a single system.
Solution Approach 2:
The patent introduces a controller as an intermediary that coordinates between the temperature control unit and the imprinting process. The controller receives feedback about magnification errors and automatically adjusts temperature parameters, thereby managing the complexity of the thermal control system through automated feedback loops rather than manual intervention.
3Manufacturing precision
If pressing members are used to correct pattern sizes, then overlapping accuracy improves, but the solution fails when relative ratio errors are excessive or deficient
Solution Approach 1:
The patent applies preliminary temperature adjustment to the substrate before the imprinting process to pre-correct magnification errors. By controlling the substrate temperature in advance to achieve the desired dimensional expansion or contraction, the system ensures that the shot region size matches the template pattern size before pressing occurs, thereby preventing excessive or deficient correction scenarios.
Solution Approach 2:
The patent introduces dynamic temperature control that can adjust substrate dimensions in real-time based on the specific magnification error detected. Rather than relying on fixed mechanical pressing, the system dynamically modifies substrate dimensions through temperature variation, allowing adaptive correction that maintains reliability across a wide range of initial errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the accuracy of pattern overlap on substrates by reducing magnification errors between the pattern and shot regions, enhancing the precision of semiconductor device manufacturing.
Implementation Method 1
a temperature control unit configured to adjust a temperature of a substrate having a shot region
Data Source
AI summary
An imprint apparatus includes: a chuck including a temperature controller configured to adjust a temperature of a substrate having a shot region, the chuck configured to hold the substrate; a template stage configured to hold a template so that a surface of the template with a pattern faces the substrate and configured to change a relative position of the substrate to the template in a vertical direction; and a controller configured to control the chuck and the template stage. The controller is configured to control the temperature controller such that the temperature of the substrate is adjusted based on a magnification error between the pattern and the shot region. The controller controls the template stage such that the pattern is transferred to the shot region of the substrate of which the temperature is adjusted.