Imprint Template Demold Control for Wafer Stability
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Solution Overview
Problem
In nanoimprint methods, the strong force required for demolding templates from wafers can cause detachment of the wafer from the chuck, especially near the periphery, which is a challenge for mass production due to uneven wafer chuck force distribution.
Innovation Solution
An imprint apparatus and method that control the demold speed and angle of the template based on the position of the shot region, optimizing demolding operations to prevent wafer detachment while maintaining throughput by selectively adjusting demold speeds and angles according to the specific regions on the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If strong force is applied for demolding the template from the wafer, then the template can be separated from the imprint material, but the wafer may be detached from the wafer chuck due to the strong force
Solution Approach 1:
The patent applies different demolding forces to different regions of the wafer by controlling the pressing device to move in specific directions. The center region receives demolding force in one direction while the periphery region receives demolding force in another direction, matching the local chuck force distribution characteristics and preventing wafer detachment.
Solution Approach 2:
The pressing device dynamically adjusts its movement direction based on the shot region position. The control unit determines the movement direction according to the shot region, enabling the demolding force direction to adapt dynamically to different locations on the wafer, thereby optimizing the balance between demolding effectiveness and wafer stability.
2Ease of operation
If uniform demolding force is applied across the entire wafer, then the demolding process is simple, but the wafer chuck force distribution is uneven causing detachment at the periphery
Solution Approach 1:
The patent implements region-specific demolding control where the pressing device applies demolding force in different directions for the center region versus the periphery region. This local differentiation addresses the uneven chuck force distribution while maintaining a relatively simple overall process flow.
Solution Approach 2:
The patent changes the parameter of demolding force direction based on the shot region position. The control unit adjusts the movement direction parameter of the pressing device according to whether the shot region is at the center or periphery, optimizing demolding effectiveness without significantly complicating the process.
3Productivity
If the demolding speed is increased to maintain throughput, then production efficiency is improved, but the risk of wafer detachment increases due to stronger forces
Solution Approach 1:
The patent applies different demolding speeds to different regions of the wafer. The pressing device moves faster when demolding the center region and slower when demolding the periphery region, allowing high throughput to be maintained in safe regions while preventing detachment in vulnerable regions.
Solution Approach 2:
The pressing device dynamically adjusts its movement speed based on the shot region position. The control unit determines the appropriate demolding speed according to the shot region, enabling the system to optimize both productivity and reliability by adapting speed to local conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents wafer detachment during demolding by optimizing demold speeds and angles, ensuring reliable pattern formation without significant reduction in throughput, even in areas prone to detachment.
Implementation Method 1
the imprint material is cured by exposure while the template is pressed onto the imprint material
Data Source
AI summary
In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.