Imprint Template Structure for Larger Vias Than Wiring Width
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Solution Overview
Problem
The miniaturization of semiconductor devices requires an imprinting technique capable of forming vias with diameters larger than the width of the wiring, which existing dual damascene methods struggle to achieve effectively, leading to issues such as connection failures and short circuits.
Innovation Solution
A template with a specific configuration, including a substrate with recessed trenches and holes, where the hole diameter is larger than the trench width, is used to create a master template for replicating via patterns in semiconductor devices, ensuring the via diameter is larger than the wiring width and reducing the risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional dual damascene methods are used, then manufacturing process is simple, but via diameter cannot be larger than wiring width
Solution Approach 1:
The template structure is segmented into distinct components: trenches for wiring formation and holes for via formation. The holes are positioned to overlap with trenches and extend deeper, allowing independent control of via diameter and wiring width. This segmentation enables the via diameter to be larger than wiring width while maintaining manufacturing precision.
Solution Approach 2:
The template design utilizes vertical depth differentiation to solve the dimensional constraint. Holes extend deeper than trenches in the template structure, creating a depth dimension that translates to via diameter control. This dimensional approach allows via openings to be larger than wiring openings at the surface level, resolving the contradiction between via size and wiring width.
2Reliability
If via diameter is increased to be larger than wiring width, then connection reliability improves, but short circuit risk increases
Solution Approach 1:
The template applies local quality differentiation where holes (for vias) and trenches (for wirings) have distinct dimensions and depths. Holes are designed with larger diameters for reliable via connections, while trenches maintain appropriate widths for wiring isolation. This localized dimensional control ensures connection reliability without increasing short circuit risk, as each structure is optimized for its specific function.
3Manufacturing precision
If template structure is made complex to form larger vias, then via diameter exceeds wiring width, but manufacturing difficulty increases
Solution Approach 1:
The template is pre-formed with the precise three-dimensional structure of trenches and holes at appropriate depths before the imprinting process. This preliminary structuring allows the complex geometry (holes extending deeper than trenches) to be manufactured once in the template, simplifying subsequent mass production. The complex via-to-wiring dimension ratio is achieved through this advance template preparation rather than during each device fabrication cycle.
Data Source
AI summary
According to one embodiment, there is provided a template including: a substrate having a first surface; a trench that is recessed from the first surface at a predetermined depth and extends along the first surface in a first direction, the trench includes a first portion having a second width in a second direction intersecting with the first direction and a second portion having a third width in the second direction; and a hole that is arranged is the first portion of the trench and extends from a bottom surface of the trench, and the first width is smaller than the second width, and the third width is smaller than the first width.