Imprint Template Stress Distribution Correction

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Solution Overview

Problem

The imprint method for semiconductor device manufacturing experiences stress concentration issues with templates, leading to reduced service life due to uneven stress distribution during the template pressing process.

Innovation Solution

A pattern data creating method that calculates and corrects stress distribution by adding an auxiliary pattern to the template pattern data, ensuring that stress values at concentration spots do not exceed a predetermined threshold, thereby uniformizing the stress applied to the template.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the template is pressed onto the resist in the imprint method, then the resist pattern is formed on the substrate, but stress concentration occurs at certain areas of the template leading to shortened service life

Engineering Contradiction:
Improveimprint process efficiencyVSAvoidtemplate service life
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces auxiliary patterns specifically at stress concentration locations on the template. These auxiliary patterns are added locally to modify the stress distribution characteristics without changing the overall template structure or function. This local modification approach allows the template to maintain its primary imprinting function while simultaneously addressing the stress concentration problem at specific critical areas.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent calculates the stress distribution in advance before the actual imprint process and identifies stress concentration spots beforehand. Based on this pre-calculated stress distribution, auxiliary patterns are designed and added to the template pattern data prior to template fabrication. This preliminary action ensures that the template is pre-optimized to prevent stress concentration before it occurs during the imprint process, thereby extending template service life.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the template pattern is corrected to reduce stress concentration, then the template service life is extended, but the template structure becomes more complex

Engineering Contradiction:
Improvetemplate service lifeVSAvoidtemplate pattern complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The auxiliary patterns are introduced only at specific stress concentration locations rather than uniformly across the entire template. This localized approach modifies the template structure minimally, adding complexity only where necessary to address stress concentration, while leaving the rest of the template structure simple and unchanged.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent modifies the template pattern by changing geometric parameters such as adding auxiliary patterns with specific shapes, sizes, and positions. These parameter changes are calculated based on the stress distribution analysis, allowing precise control over the stress reduction effect while maintaining reasonable template complexity.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9971342B2Pattern data creating method, template, and semiconductor device manufacturing method
Publication Date: 2018.05.15 KIOXIA CORP
  • US9971342B2 patent drawing
  • US9971342B2 patent drawing
  • US9971342B2 patent drawing

AI summary

According to one embodiment, a pattern data creating method includes a calculation process, a determination process, and a correction process. In the calculation process, it is calculated a stress distribution of stresses that are applied to a template when a distance between the template and a substrate on which resist are disposed is predetermined, the template including a template pattern. In the determination process, it is determined whether or not there is a stress concentration spot in the template pattern at which a stress value larger than a predetermined criterion value is to appear. If the stress concentration spot is present, in the correction process, it is a corrected pattern data of the template pattern such that the stress value at the stress concentration spot becomes a stress value not larger than the predetermined criterion value.