Imprint Method Two-Stage Curing Alignment Accuracy
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Solution Overview
Problem
The existing imprint techniques face challenges in achieving both high alignment accuracy between a mold and a substrate and maintaining throughput, primarily due to external disturbances like vibrations, which affect the viscosity control of the imprint material during the alignment process.
Innovation Solution
The method involves a two-stage curing process, where the imprint material is initially cured to a first target hardness using light with high reaction sensitivity in parallel with alignment, and then further cured to a second target hardness using light with lower reaction sensitivity after alignment, allowing for improved viscosity control and reduced disturbance impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light with low reaction sensitivity is used to gradually increase viscosity during alignment, then alignment accuracy is improved, but throughput decreases due to long curing time
Solution Approach 1:
The curing process is segmented into two distinct stages: preliminary curing with first light (high reaction sensitivity) to rapidly achieve initial hardness, and main curing with second light (lower reaction sensitivity) to gradually increase viscosity during alignment. This segmentation allows each stage to optimize for its specific purpose, resolving the contradiction between speed and precision
Solution Approach 2:
Preliminary curing is performed before or in parallel with alignment to establish a base hardness level. This preliminary action reduces the burden on the main curing stage, allowing alignment to proceed with controlled viscosity increase without compromising throughput, as the material already has sufficient initial structural support
2Productivity
If light with high reaction sensitivity is used to quickly cure the imprint material, then throughput is improved, but alignment accuracy decreases due to rapid viscosity increase affecting mold-substrate positioning
Solution Approach 1:
The curing process is divided into preliminary curing (high sensitivity, fast) and main curing (low sensitivity, slow). The preliminary curing provides rapid initial hardness for throughput, while the main curing handles the gradual viscosity increase needed for alignment accuracy, preventing the harmful effect of rapid viscosity change during positioning
Solution Approach 2:
The first light provides excessive initial curing action to ensure rapid hardness achievement, while the second light provides the precise, controlled action needed for alignment. This partial action approach allows the high-sensitivity light to operate at full speed without compromising alignment, since the low-sensitivity light will subsequently control the viscosity increase during alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances alignment accuracy while maintaining throughput by controlling the viscosity of the imprint material effectively, reducing the influence of external disturbances and ensuring precise pattern transfer.
Implementation Method 1
irradiating the imprint material with light to cure the imprint material
Data Source
AI summary
The present invention provides an imprint method of forming a pattern on an imprint material on a substrate using a mold, comprising: performing preliminary curing of irradiating the imprint material with light to cure the imprint material to a first target hardness; and performing main curing of irradiating the imprint material with curing light to cure the imprint material to a second target hardness, wherein the preliminary curing includes a first process of irradiating the imprint material with first light to which the imprint material has first reaction sensitivity, and a second process of irradiating the imprint material with second light to which the imprint material has second reaction sensitivity lower than the first reaction sensitivity, and is controlled such that an end timing of the second process is later than an end timing of the first process.