Imprint Underlayer Film Kit for Semiconductor Wettability
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Solution Overview
Problem
The existing photo-nanoimprint method lacks adequate wettability of the curable composition with respect to the underlayer film, affecting the adhesion and processing quality in semiconductor device manufacturing.
Innovation Solution
A kit comprising a curable composition with a polymerizable compound having an aromatic ring and an underlayer film composition containing a specific polymer with a constitutional unit represented by Formulae (1) to (6), where the polymerizable compound's continuous partial structure with an aromatic ring accounts for 60% or more of the polymerizable compound, and the Hansen solubility parameter difference between the curable composition and the underlayer film is minimized to enhance interfacial tension reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a composition for forming an underlayer film is used to improve adhesiveness between the substrate and imprint layer, then adhesiveness is improved, but wettability of the curable composition with respect to the underlayer film deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters of the underlayer film-forming composition by specifying a polymer with particular structural features (Formulae 1-6) and controlling the content of polymerizable compounds (0.1-10 mass%). This parameter optimization resolves the contradiction by achieving both improved adhesiveness through enhanced chemical bonding capability and maintained wettability through controlled surface energy properties.
Solution Approach 2:
The invention creates a composite material system consisting of the underlayer film-forming composition (with specific polymer and additives) combined with the curable composition for imprinting. The composite structure allows the underlayer to provide adhesiveness while the curable composition maintains its wettability, resolving the contradiction through material composition design.
2Ease of operation
If the polymerizable compound content is increased to improve wettability, then wettability is improved, but adhesiveness deteriorates
Solution Approach 1:
The invention optimizes the polymerizable compound content parameter within the specific range of 0.1-10 mass% to balance wettability and adhesiveness. This parameter control prevents excessive polymerization that would harm wettability while ensuring sufficient adhesive bonding capability, resolving the contradiction through precise compositional specification.
3Temperature
If a light-transmitting mold is used to enable UV nanoimprint method, then processing temperature can be maintained at room temperature, but wettability and adhesiveness of the curable composition are insufficient
Solution Approach 1:
The invention introduces an underlayer film as an intermediary between the substrate and the curable composition for imprinting. This underlayer film acts as a mediator that enhances both wettability and adhesiveness, allowing the UV nanoimprint process to proceed at room temperature while achieving sufficient bonding strength through the underlayer's specialized composition.
Solution Approach 2:
The invention creates a composite structure with the underlayer film-forming composition that specifically addresses the wettability and adhesiveness issues. The composite material system (underlayer + curable composition) enables room temperature processing with a light-transmitting mold while achieving the required bonding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves both wettability and adhesiveness between the curable composition and the underlayer film, leading to improved processing quality and throughput in semiconductor device manufacturing, enabling high-resolution and high-throughput production.
Implementation Method 1
a pattern is formed on a cured film of the photosensitive resin composition disposed on a substrate by radiating light through a mold
Implementation Method 2
the Hansen solubility parameter difference between the curable composition and the underlayer film is minimized to enhance interfacial tension reduction
Data Source
AI summary
Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.