Imprint Underlayer Film Composition to Prevent Mold Particle Damage

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Solution Overview

Problem

The formation of fine particles from metal components in the underlayer film composition can cause damage to the mold during the imprinting process, leading to reduced dimensional accuracy and potential mold damage.

Innovation Solution

Incorporating a chelating agent into the underlayer film composition, specifically a high-molecular-weight compound with a polymerizable group and a solvent, to capture and suppress the aggregation of metal components, thereby preventing particle formation and mold damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a composition for forming an underlayer film is used in the imprinting process, then adhesiveness between the substrate and the curable composition is improved, but metal components in the composition aggregate to form fine particles that can damage the mold

Engineering Contradiction:

Improveadhesiveness between substrate and curable compositionVSAvoidmold damage from fine particle aggregation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An underlayer film is introduced as an intermediary between the substrate and the curable composition. This underlayer film serves as a mediator that provides the necessary adhesiveness to withstand the releasing operation while preventing the aggregation of metal components that would otherwise damage the mold during imprinting.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The problematic metal components are extracted or isolated from the curable composition by placing them in a separate underlayer film. This separation removes the harmful aggregation effect from the curable composition while maintaining the adhesiveness function through the underlayer film's composition design.

Inventive Principle:

Principle #2Taking out (Extraction)

2Manufacturing precision

If the mold is pressed against the substrate with high pressure to transfer the pattern, then the pattern transfer accuracy is improved, but the risk of mold damage from fine particles increases

Engineering Contradiction:

Improvepattern transfer accuracyVSAvoidmold damage from fine particle aggregation

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The underlayer film acts as a protective intermediary layer between the substrate and the curable composition, enabling high-pressure pressing for accurate pattern transfer while preventing fine particle aggregation from reaching and damaging the mold surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The underlayer film is prepared in advance as a protective barrier that cushions against potential mold damage from fine particles during the high-pressure pressing operation, allowing accurate pattern transfer without compromising mold integrity.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of a chelating agent in the underlayer film composition effectively prevents mold damage by stabilizing metal components, ensuring precise and accurate pattern formation without compromising the integrity of the mold.

Implementation Method 1

Methodology Applied

Scientific EffectChelation:

Data Source

PatentUS12421343B2Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element

Publication Date: 2025.09.23 FUJIFILM CORP

AI summary

Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.