Imprinted Multi-Layer Micro-Wire Structure for Transparent Electrodes
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Solution Overview
Problem
Current transparent electrodes, such as those used in flat-panel displays and touch screens, face challenges with limited transparency and conductivity, high production costs, and mechanical stress susceptibility, while existing manufacturing methods are complex and require multiple steps.
Innovation Solution
The development of an imprinted multi-layer micro-wire structure with interconnected patterns formed in multiple layers, using a substrate with imprinted micro-channels filled with conductive ink, allowing for improved complexity, connectivity, and manufacturability, and enabling electrical connection between micro-wires in different layers without the need for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transparent conductive metal oxides are used to form electrodes, then conductivity is improved, but transparency is reduced and cost increases
Solution Approach 1:
The electrode is segmented into multiple thin transparent conductive oxide layers separated by transparent insulating layers, allowing each layer to be thinner and more transparent while maintaining overall conductivity through the stacked configuration
Solution Approach 2:
The solution transitions from a single-plane electrode to a multi-layer stacked structure in the vertical dimension, enabling improved conductivity through multiple conductive paths while maintaining transparency through thin layer design
2Reliability
If thicker layers of metal oxides or metals are used to increase conductivity, then conductivity is improved, but transparency is reduced
Solution Approach 1:
Instead of using one thick conductive layer, the total conductive material is segmented into multiple thinner layers stacked vertically, each contributing to conductivity while individual thinness preserves transparency
Solution Approach 2:
The electrode structure becomes a composite of alternating transparent conductive oxide layers and transparent insulating layers, combining the conductive function with the transparent function in a layered composite material system
3Ease of manufacture
If conventional single-layer micro-wire structures are used, then manufacturing is simpler, but electrical connectivity and complexity are limited
Solution Approach 1:
The patent extends the micro-wire structure from a single layer to multiple stacked layers, adding the vertical dimension to enable complex three-dimensional electrical interconnections while using conventional planar manufacturing processes for each layer
Solution Approach 2:
Each layer is manufactured independently with preliminary patterning and alignment, then stacked and bonded together, allowing complex connectivity to be built up systematically layer by layer using simple repeated processes
4Reliability
If transparent conductive metal oxides are used, then electrode function is achieved, but mechanical stress resistance is poor
Solution Approach 1:
The brittle transparent conductive oxide is segmented into multiple thin layers separated by flexible transparent insulating layers, which can accommodate mechanical stress and deformation without cracking the conductive layers
Solution Approach 2:
The transparent insulating layers act as flexible buffer films between the rigid conductive oxide layers, providing mechanical compliance and stress distribution that protects the brittle conductive material from cracking
Data Source
AI summary
An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.