Imprinting Alignment via Fiducial Offset Feedback
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Solution Overview
Problem
Current imprinting technologies face challenges in aligning substrates with templates, aligning imprints with resist, and achieving precise multi-objective alignments, particularly in single-sided and double-sided imprinting processes, leading to inaccuracies and non-repeatability.
Innovation Solution
The method involves measuring template and imprint fiducial marks using inspection systems to determine offsets, adjusting alignment offsets based on loading, dispense, and nominal corrections, and iteratively updating these offsets through machine learning and image analysis to achieve precise alignment and overlay accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional imprinting alignment methods are used, then the process is simple, but the overlay accuracy and alignment precision are insufficient
Solution Approach 1:
The system implements feedback loops where measurement data from fiducial marks is continuously fed back to update alignment offsets. The control system uses measured template offsets, wafer registration offsets, and overlay biases to iteratively refine alignment parameters, achieving sub-100 μm overlay accuracy through closed-loop control
Solution Approach 2:
The patent replaces manual mechanical alignment methods with automated optical measurement systems and computational algorithms. Inspection systems capture images of fiducial marks, and software algorithms automatically calculate offsets and update alignment parameters, eliminating the need for manual mechanical adjustment
2Manufacturing precision
If multiple alignment corrections are applied, then the alignment precision improves, but the process complexity increases
Solution Approach 1:
The system performs preliminary measurements of template fiducial marks and calculates template offsets before the actual imprinting process. Alignment offsets are pre-computed and prepared, allowing the imprinting to proceed without real-time calculation delays, thus maintaining high productivity while achieving precise alignment
3Reliability
If iterative offset updates are performed, then the repeatability improves, but the processing time increases
Solution Approach 1:
The system maintains continuous operation by performing offset updates in the background during non-critical phases. Measurement and calculation processes run continuously without interrupting the main imprinting workflow, ensuring repeatability improvements are achieved without significant time loss to the primary manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables sub-100 μm/0.5 arc-minute overlay accuracy, sub-200 μm imprint to wafer centering accuracy, and sub-100 μm imprint to resist alignment accuracy, improving repeatability and stability in imprinting processes.
Implementation Method 1
measuring the template fiducial mark of the template to determine a template offset; measuring the imprint fiducial mark of the imprint to determine a wafer registration offset
Implementation Method 2
curing the resist to form an imprint on the substrate
Data Source
AI summary
Systems and methods for managing multi-objective alignments in imprinting (e.g., single-sided or double-sided) are provided. An example system includes rollers for moving a template roll, a stage for holding a substrate, a dispenser for dispensing resist on the substrate, a light source for curing the resist to form an imprint on the substrate when a template of the template roll is pressed into the resist on the substrate, a first inspection system for registering a fiducial mark of the template to determine a template offset, a second inspection system for registering the imprint on the substrate to determine a wafer registration offset between a target location and an actual location of the imprint, and a controller for controlling to move the substrate with the resist below the template based on the template offset, and determine an overlay bias of the imprint on the substrate based on the wafer registration offset.