Imprinting Apparatus Alignment Mark Selection for Edge Overlay Accuracy
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Solution Overview
Problem
Existing imprinting technologies face challenges in achieving high overlay accuracy, particularly for shot regions on the outer circumference of substrates, due to uneven restraint conditions and thermal expansion issues, which affect the alignment and pattern formation process.
Innovation Solution
The use of an imprinting apparatus with a detection unit to identify and align multiple marks on the substrate and mold, adjusting the alignment marks' positions based on their proximity to the center, especially for shot regions on the outer circumference, to improve measurement accuracy and thermal deformation alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment marks are arranged in standard positions for all shot regions, then the alignment process is simple and uniform, but the overlay accuracy deteriorates in shot regions located on the outer circumferential portion of the substrate due to uneven restraint conditions and thermal expansion
Solution Approach 1:
The patent applies local quality by differentiating the arrangement of alignment marks based on the location of shot regions. For shot regions on the outer circumferential portion of the substrate, the alignment marks are arranged at positions that account for the uneven restraint conditions and thermal expansion characteristics specific to that location. This localized adaptation of alignment mark positioning improves overlay accuracy in edge regions without requiring complete redesign of the entire alignment system.
2Temperature
If the substrate is heated uniformly across the entire surface, then the heating process is simple, but the overlay accuracy deteriorates due to non-uniform thermal expansion in different regions of the substrate
Solution Approach 1:
The patent addresses non-uniform thermal expansion by implementing localized heating regions rather than uniform heating across the entire substrate. The heating apparatus is configured to apply heat selectively to specific shot regions, allowing control over the thermal expansion characteristics in different areas. This enables compensation for the uneven restraint conditions at the substrate edges while maintaining simpler heating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the overlay accuracy for shot regions on the outer circumference by minimizing the impact of thermal expansion and uneven restraint conditions, ensuring precise alignment and pattern formation.
Implementation Method 1
a detection unit configured to detect at least a plurality of marks on the substrate in each shot region
Implementation Method 2
a process of applying heat to a substrate by irradiating the substrate, in which the substrate is irradiated with light to heat the substrate so that the substrate is thermally deformed
Data Source
AI summary
An imprinting apparatus which is advantageous in improving the overlay accuracy in a shot located on an outer circumference of a substrate is provided. An imprinting apparatus which forms a pattern of an imprint material above a shot region of a substrate by performing alignment between each shot region of the substrate and a mold using a plurality of marks provided in each shot region of the substrate and a plurality of marks on the mold includes: a detection unit configured to detect at least a plurality of marks on the substrate in each shot region; and a control unit configured to use a first mark which is closest to a center of the substrate, a second mark which is arranged in a direction of a first axis along one side of the shot region with respect to the first mark, and a third mark which is arranged in a direction of a second axis perpendicular to the first axis with respect to the first mark for the alignment in each shot region, wherein the control unit uses, as the second mark, a mark which is arranged at a position closet to the center of the substrate in the shot region than that in a case in which the shot region is not located on the outer circumferential portion of the substrate when a shot region which is located on an outer circumferential portion of the substrate and whose center is located within the range of ±45° from the first axis is subjected to the alignment, and the control unit uses, as the third mark, a mark which is arranged at a position closer to the center of the substrate in the shot region than that in a case in which the shot region is not located on the outer circumferential portion of the substrate when a shot region which is located on the outer circumferential portion of the substrate and whose center is located within the range of ±45° from the second axis is subjected to the alignment.