Semiconductor Imprinting Alignment Using Adaptive Pre-Irradiation
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Solution Overview
Problem
In the imprinting method for forming fine patterns on semiconductor substrates, adjusting the relative positional relationship between the original plate and the substrate to minimize alignment errors is challenging due to variations in the transfer target material and substrate conditions, requiring frequent recalibration of irradiation conditions to increase the viscosity of the transfer target material effectively.
Innovation Solution
An imprinting device with an aligner, first and second irradiators, an index acquirer, memory, and a controller that adjusts the irradiation conditions based on acquired accuracy indexes to optimize the viscosity of the transfer target material, allowing for precise alignment and pattern transfer across multiple substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the transfer target material is irradiated with light to increase viscosity before alignment, then vibration between the original plate and substrate is reduced, but the alignment adjustment becomes more difficult due to increased material rigidity
Solution Approach 1:
The system performs preliminary alignment adjustment before irradiating the transfer target material with light to increase its viscosity. By completing the alignment operation while the material is still in a softer, more adjustable state, the system avoids the difficulty of adjusting alignment after the material has hardened from light exposure.
Solution Approach 2:
The system dynamically changes the physical state of the transfer target material during the process - keeping it in a softer state during alignment operations and then transitioning it to a harder state after alignment is complete by applying light irradiation. This dynamic state change optimizes both alignment ease and final pattern stability.
2Manufacturing precision
If the irradiation condition is adjusted frequently to account for variations in transfer target material and substrate, then alignment accuracy is improved, but the manufacturing time and process complexity increase
Solution Approach 1:
The system incorporates a feedback mechanism where the alignment result is detected and used to determine subsequent irradiation conditions. The aligner adjusts the relative position between original plate and substrate, then a detector measures the alignment result, which feeds back to control the irradiation process. This closed-loop feedback ensures high alignment accuracy without requiring excessive manual recalibration.
Solution Approach 2:
The system uses the alignment result itself to guide the irradiation process - the detected alignment state automatically determines the appropriate irradiation conditions, eliminating the need for external operators to manually adjust parameters for each variation in material or substrate conditions.
3Stability of the object's composition
If the transfer target material is irradiated early to increase viscosity, then alignment stability is improved, but the material may become too rigid for precise positioning
Solution Approach 1:
The system performs the preliminary alignment positioning before irradiating the transfer target material with light. By completing all necessary positioning adjustments while the material remains in its softer, more compliant state, the system achieves precise positioning without the material becoming overly rigid during the alignment process.
Solution Approach 2:
The system employs periodic action by applying light irradiation in a controlled sequence - first allowing alignment operations during the pre-irradiation phase, then applying irradiation to increase viscosity and stabilize the pattern after positioning is complete. This temporal separation of operations optimizes both positioning precision and alignment stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and accurate adjustment of irradiation conditions, reducing alignment errors and ensuring consistent pattern transfer quality across different substrates, thereby improving the manufacturing process for semiconductor devices like NAND flash memory.
Implementation Method 1
a first irradiator configured to irradiate the transfer target material with first light based on an irradiation condition before the aligner adjusts the relative position between the original plate and the substrate
Implementation Method 2
a second irradiator configured to cure the transfer target material by irradiating the transfer target material with second light after the aligner adjusts the relative position between the original plate and the substrate
Data Source
AI summary
An imprinting device includes an aligner configured to adjust a relative position between an original plate and a substrate when the original plate including a pattern is moved into contact with the substrate including a transfer target material; a first irradiator configured to irradiate the transfer target material with first light based on an irradiation condition before adjusting the relative position; a second irradiator configured to cure the transfer target material by irradiating the transfer target material with second light after adjusting the relative position; an index acquirer configured to acquire an accuracy index indicating an adjustment accuracy of the adjusted relative position; a memory configured to store data including a plurality of the accuracy indexes acquired for a plurality of the substrates; and a controller configured to adjust the irradiation condition when subsequently using the first irradiator based on the data.