Imprinting Method Attraction Force Control
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Solution Overview
Problem
The existing imprinting technologies face challenges in maintaining positioning accuracy when the substrate holding unit changes attraction forces, leading to potential displacement of shot areas and reduced overlay accuracy during semiconductor device manufacturing.
Innovation Solution
An imprinting method that adjusts attraction forces between different areas of a substrate holding unit, uses alignment marks to measure and correct positional displacement, and adjusts the imprinting process based on threshold values to ensure accurate pattern formation without compromising positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the attraction force of the first attraction area is reduced to less than the attraction force of the second attraction area during sequential pattern formation, then the positioning accuracy is maintained, but the holding stability of the substrate is compromised
Solution Approach 1:
The substrate holding unit is divided into multiple attraction areas (first attraction area and second attraction area) that can be independently controlled. This segmentation allows different attraction forces to be applied to different regions of the substrate, enabling reduced attraction force in the first attraction area during sequential pattern formation while maintaining adequate holding stability through the second attraction area.
Solution Approach 2:
The attraction forces of the attraction areas are made dynamically adjustable during the imprinting process. The control unit changes the attraction forces sequentially - reducing the first attraction area's force during pattern formation while maintaining or increasing the second attraction area's force - thereby adapting the holding stability to the specific process stage.
2Ease of manufacture
If the attraction forces of attraction areas are changed to transfer patterns to non-adjacent shot areas, then the strain influence is avoided, but the substrate position is displaced from the original position
Solution Approach 1:
The substrate holding unit is divided into multiple independently controllable attraction areas, allowing selective attraction force adjustment for transferring patterns to non-adjacent shot areas. This segmentation enables avoiding strain influence while maintaining position accuracy through independent control.
Solution Approach 2:
The control unit monitors and adjusts the attraction forces of different attraction areas based on the sequential pattern formation process. By providing feedback control, the system can change attraction forces to transfer patterns to non-adjacent shot areas while compensating for any position displacement through real-time adjustment.
3Measurement precision
If the attraction force is increased to hold the substrate firmly, then the positioning stability is improved, but the pattern may fall in resin when the mold is released
Solution Approach 1:
The substrate holding unit is segmented into multiple attraction areas with independently controllable attraction forces. This allows the system to apply high attraction force to specific areas during positioning while reducing attraction force in other areas during mold release to prevent pattern fall, resolving the contradiction between positioning stability and pattern integrity.
Solution Approach 2:
The attraction forces are dynamically adjusted according to the process stage - high attraction force is applied during positioning and pattern formation to ensure stability, while the attraction force is reduced during mold release to prevent pattern fall. This dynamic control resolves the contradiction between these opposing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise pattern formation on substrates with minimal positional displacement, maintaining high overlay accuracy even when attraction forces are changed, thereby improving the semiconductor device manufacturing process.
Implementation Method 1
a substrate holding unit having at least a first attraction area and a second attraction area, and in which attraction forces of the attraction areas are changeable
Implementation Method 2
the pattern is formed in each of the shot areas by curing an imprint material supplied on the substrate with the imprint material in contact with a mold
Data Source
AI summary
Arrangement information regarding shot areas is obtained in an imprinting method. When a pattern is sequentially formed in the shot areas, the attraction force of a first attraction area is reduced to less than that of the second attraction area. After the pattern is formed in the shot area corresponding to the first attraction area, the attraction forces of the first and second attraction areas are changed. The position information regarding the shot area corresponding to the second attraction area is obtained, which is compared with the position information regarding the shot area corresponding to the second attraction area based on the arrangement information. If the difference between the compared position information is a threshold value or less, positioning of a substrate and a mold is achieved using the arrangement information. If the difference is greater than the threshold value, the arrangement information regarding the shot areas is obtained again.