Imprinting System Droplet Control for Semiconductor Resist Defects
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Solution Overview
Problem
The existing imprinting methods face challenges in reducing protrusion defects in resist patterns, which can lead to poor processing quality in semiconductor device production, and there is a need for a more efficient way to adjust the arrangement of droplets to minimize these defects.
Innovation Solution
An imprinting system that includes a measuring device to assess the intensity of light reflected from a monitor substrate, a recipe generation device to create drop recipes based on this measurement, and an imprinting apparatus that adjusts the arrangement of droplets on a production substrate using a control unit, allowing for real-time modulation of droplet arrangement to reduce protrusion defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional imprinting method is used, then the imprinting process can be completed, but protrusion defects occur in the resist pattern
Solution Approach 1:
The system performs preliminary measurement of light reflection intensity from the substrate before the imprinting process, and pre-calculates the optimal droplet arrangement pattern based on the measured substrate characteristics. This preliminary preparation allows the resist to be applied with the correct droplet distribution from the start, preventing protrusion defects rather than correcting them afterward
Solution Approach 2:
The system measures the light reflection intensity from the substrate, uses this feedback information to determine the appropriate droplet arrangement pattern, and then applies the resist accordingly. This closed-loop feedback mechanism ensures that the droplet arrangement is optimized for each specific substrate, minimizing protrusion defects while maintaining pattern quality
2Manufacturing precision
If the arrangement of droplets is adjusted to reduce protrusion defects, then pattern quality improves, but the complexity of the imprinting system increases
Solution Approach 1:
The system replaces complex mechanical adjustment mechanisms with a computational approach. Instead of physically adjusting droplet arrangement through complex mechanical means, the system uses light reflection measurements and computational algorithms to determine optimal droplet patterns, then applies them through controlled resist dispensing. This substitution of mechanical complexity with optical measurement and computational processing reduces overall system complexity while maintaining high pattern quality
Solution Approach 2:
The system changes the arrangement parameters of droplets based on measured light reflection intensity. By dynamically adjusting droplet distribution parameters according to substrate characteristics, the system achieves high pattern quality without requiring permanently complex mechanical structures. The flexibility comes from programmable parameter control rather than fixed mechanical complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the generation of appropriate drop recipes that effectively reduce protrusion defects by adjusting the arrangement of droplets based on light intensity measurements, improving the quality of semiconductor device production by minimizing protrusion defects and facilitating non-destructive inspection.
Implementation Method 1
a first measuring device to measure an intensity of light reflected from an end of a shot area of a monitor substrate
Implementation Method 2
ultraviolet light is emitted to cure the resist
Data Source
AI summary
An imprinting system according to an embodiment includes a first measuring device measuring an intensity of light reflected from an end of a shot area of a monitor substrate being an area on which imprinting has been performed, a dripping condition generating device generating a dripping condition of a resin-based mask material on the basis of the measured intensity of light, and an imprinting apparatus performing imprinting using the dripping condition. The imprinting apparatus includes a second measuring device measuring an intensity of light reflected from an end of a first shot area of a production substrate being an area on which imprinting has been performed, and a control unit adjusting arrangement of droplets of a resin-based mask material ejected on a second shot area of the production substrate being an area on which imprinting is to be performed on the basis of an intensity of light reflected from an end of the first shot area.