Imprinting Device Flow Control Pattern for Uniform Thin Film
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Solution Overview
Problem
Conventional mold patterns do not account for the flow amount and speed of thin films during nano-imprint technology, leading to irregular film formation and residual layers due to inadequate control over the flow and patterning process.
Innovation Solution
An imprinting device with a first substrate featuring transmittance and light blocking areas, a light blocking layer, and a patterned layer including etch and flow control patterns to manage the flow of the thin film, ensuring uniformity and complete removal of unnecessary film parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional mold substrate with simple concavo-convex pattern is used, then the manufacturing process is simple, but the thin film flow amount and speed cannot be controlled resulting in irregular film formation
Solution Approach 1:
The mold substrate is divided into different functional regions: etch patterns for pattern transfer and flow control patterns for regulating thin film flow. Each region has specialized structures (convex/concave shapes, widths, positions) optimized for its specific function, allowing precise control of thin film behavior in different areas while maintaining overall manufacturing feasibility
Solution Approach 2:
The patterned layer is segmented into multiple independent pattern elements including etch patterns and flow control patterns. These segmented patterns can be independently designed and optimized for their specific functions, enabling precise control over thin film flow dynamics and pattern formation
2Device complexity
If conventional mold substrate is used without flow control features, then the device structure is simple, but residual layers remain after detaching the mold substrate
Solution Approach 1:
Flow control patterns are pre-formed on the mold substrate before thin film deposition and patterning. These pre-formed patterns create controlled flow paths that guide the thin film during the imprinting process, ensuring complete pattern transfer and preventing residual layer formation from the outset
Solution Approach 2:
The flow control patterns act as intermediary structures between the mold substrate and the thin film. These intermediate features regulate the interaction between the mold and thin film by controlling flow dynamics, ensuring complete pattern transfer while maintaining simple mold substrate construction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves uniform thin film patterning and prevents residual layers by controlling the flow and patterning of the thin film using the flow control pattern, improving the overall uniformity and productivity of the nano-imprint process.
Implementation Method 1
a light blocking layer formed on the first substrate corresponding to the at least one light blocking area to block the light
Implementation Method 2
a patterned layer formed on the first substrate to press an imprinting object. The etch pattern is formed on the first substrate corresponding to the at least one transmittance area and may have a concavo-convex shape
Implementation Method 3
The flow control pattern is formed on the first substrate corresponding to the at least one light blocking area while covering the light blocking layer to control a flow of the imprinting object that is pressed by the patterned layer
Data Source
AI summary
An imprinting device includes a first substrate, a light blocking layer formed on the first substrate corresponding to a light blocking area, and a patterned layer formed on the first substrate. The patterned layer includes an etch pattern and a flow control pattern formed on the first substrate corresponding to a transmittance area and the light blocking area, respectively. When the patterned layer presses a resin layer, the resin layer pressed by the etch pattern moves towards the flow control pattern or a photosensitive resin layer pressed by the flow control pattern moves towards the etch pattern according to a shape of the flow control pattern. Thus, when the shape of the flow control pattern is controlled, the resin layer pressed by the patterned layer may be formed with a uniform thickness.