Imprinting Mold Separation via Segmented Vacuum Adsorption
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Solution Overview
Problem
The existing methods for fabricating flat panel display devices face challenges in easily separating the imprinting mold from the substrate, as larger substrates require larger molds, leading to difficulties in supply and increased mechanical force, which can result in mold breakage.
Innovation Solution
An apparatus and method utilizing first and second adsorption pads with vacuum-adsorption capabilities, along with a connector connected to vacuum pins, to facilitate the separation of the imprinting mold from the substrate by applying force at the periphery of the mold, reducing the required separation force and preventing breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the imprinting mold is formed larger than the substrate to facilitate separation, then the separation process becomes easier, but the size of the imprinting mold increases making supply difficult
Solution Approach 1:
The adsorption pads are divided into multiple regions (center region and periphery region) with different adsorption strengths. The center adsorption pad provides strong adsorption during imprinting, while the periphery adsorption pads provide weak adsorption during separation, allowing easy mold removal without increasing mold size
Solution Approach 2:
Different regions of the adsorption pad system have different adsorption characteristics - the center region has strong adsorption for secure bonding during imprinting, while the periphery regions have weak adsorption for easy separation. This local differentiation resolves the contradiction between secure bonding and easy separation without increasing mold dimensions
2Area of stationary object
If the imprinting mold and substrate are formed to have the same size to reduce mold size, then the mold size is decreased, but high mechanical force is required to separate the mold from the substrate
Solution Approach 1:
The adsorption force is segmented into different magnitudes across different regions - strong adsorption at the center and weak adsorption at the periphery. This allows the mold to be the same size as the substrate while requiring only low force for separation, as the weak periphery adsorption pads release first during separation
Solution Approach 2:
The adsorption strength parameter is changed spatially across different regions of the adsorption pad system. By making the periphery adsorption weaker than the center adsorption, the separation force required is reduced significantly while maintaining the same mold-substrate size relationship
3Ease of operation
If high mechanical force is applied to separate the mold from the substrate, then separation is achieved, but breakage of the imprinting mold occurs
Solution Approach 1:
The adsorption pad system is segmented into center and periphery regions with different adsorption strengths. During separation, the weak periphery adsorption pads release first at low force, preventing mold breakage, while still achieving effective separation. This eliminates the need for high mechanical force that would cause mold damage
Solution Approach 2:
The weak periphery adsorption pads act as a cushioning mechanism that releases first during separation, protecting the mold from sudden high-stress events. This beforehand design prevents mold breakage by providing a gentle release mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for easy and efficient separation of the imprinting mold from the substrate using lower forces, reducing the risk of mold breakage and improving production efficiency by distributing the separation force along the periphery of the mold.
Implementation Method 1
a first adsorption pad to vacuum-adsorb the center of the imprinting mold
Implementation Method 2
a second adsorption pad to vacuum-adsorb the periphery of the imprinting mold
Data Source
AI summary
Disclosed are an apparatus and method for fabricating a flat panel display device to realize easy separation of a substrate from an imprinting mold. The apparatus includes an imprinting mold connected to a substrate to form a thin film pattern on the substrate, a first adsorption pad to vacuum-adsorb the center of the imprinting mold, a second adsorption pad to vacuum-adsorb the periphery of the imprinting mold, and a connector connected to vacuum pins to vertically move in different regions of the first and second adsorption pads.