Imprinting Mold Thermal Deformation Control via Running-In Substrate
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Solution Overview
Problem
The existing imprinting technologies face issues with thermal deformation of master molds due to heat absorption by chromium films, leading to pattern misalignment and distortion, and result in low throughput due to the need for waiting for temperature stabilization.
Innovation Solution
The method involves using a running-in substrate with higher heat conductivity than the blank mold substrate, allowing heat energy absorbed during the running-in process to be efficiently transferred and dissipated, reducing thermal deformation of the master mold and enabling immediate transition to the next imprinting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chromium film is provided on the running-in substrate to improve mold releasability, then the separating force is reduced, but the master mold temperature rises due to heat absorption and conduction, causing thermal deformation
Solution Approach 1:
A heat-resistant layer is introduced as an intermediary between the chromium film and the master mold. This layer acts as a thermal barrier that prevents heat conducted from the chromium film from reaching the master mold, thereby preventing thermal deformation while maintaining the mold releasability provided by the chromium film.
Solution Approach 2:
The substrate structure is made composite by combining the chromium film layer with a heat-resistant layer having different thermal properties. This composite structure allows the chromium film to provide mold releasability while the heat-resistant layer with lower thermal conductivity or higher heat capacity prevents heat transfer to the master mold.
2Manufacturing precision
If the master mold is allowed to cool down completely before the next imprinting to avoid thermal deformation, then pattern accuracy is maintained, but the waiting time increases, reducing throughput
Solution Approach 1:
The heat-resistant layer is prepared in advance on the running-in substrate. This preliminary structural preparation ensures that during subsequent imprinting operations, heat is already blocked from reaching the master mold, eliminating the need for waiting periods and allowing continuous high-speed production without thermal deformation.
Solution Approach 2:
The heat-resistant layer enables continuous imprinting operations without interruption for cooling the master mold. By preventing heat accumulation in the master mold, the system maintains pattern accuracy while sustaining continuous production, thereby improving throughput.
3Manufacturing precision
If the running-in process is performed multiple times to reduce thermal deformation, then pattern accuracy improves, but the total process time increases, reducing efficiency
Solution Approach 1:
The heat-resistant layer is applied in advance to the running-in substrate during substrate preparation. This preliminary action ensures that thermal deformation is prevented from the first imprinting operation, eliminating the need for multiple running-in processes and reducing total process time while maintaining pattern accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes thermal deformation of the master mold, reduces waiting time, and enhances the throughput of replica mold production by maintaining pattern accuracy and consistency.
Implementation Method 1
A first base material of the first substrate is higher in heat conductivity than a second base material of the second substrate
Implementation Method 2
a part of light applied to the resin in the imprinting does not pass through the chromium film and is absorbed by the chromium film as heat energy
Implementation Method 3
When the heat absorbed by the chromium film is transferred to a master mold through heat conduction, the temperature of the master mold rises
Data Source
AI summary
An imprinting method for forming a pattern on a substrate with use of a mold, includes performing a running-in process in which the mold is brought into contact with a composition on a first substrate held by a holding unit, the composition on the first substrate is exposed, and the mold is released. After the running-in process, the method includes performing an imprinting process in which the mold is brought into contact with a composition on a second substrate, the composition on the second substrate is exposed, the mold is released, and the pattern is formed on the composition on the second substrate. A base material of the first substrate is higher in heat conductivity than a base material of the second substrate. The second substrate is used as an imprint mold.