Imprinting Template Fabrication via Semiconductor Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing imprinting templates are inefficient in producing templates with high aspect ratio patterns, are time-consuming, and costly, and struggle to achieve deep profiles in nano dimensions, which limits their application in advanced technologies like photonic crystal structures for LED devices.
Innovation Solution
A semiconductor manufacturing process is used to create imprinting templates with pillar-shaped holes or pillars by forming an oxide layer on a substrate, followed by microlithography and etching to achieve deep profiles and customized patterns, enabling efficient and cost-effective production of sub-micro or nano dimension templates suitable for photonic crystal structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional direct writing methods (e-beam, X-ray, ion beam) are used to manufacture imprinting templates, then pattern precision can be achieved, but manufacturing time and cost increase significantly
Solution Approach 1:
The manufacturing process is segmented into multiple standard semiconductor fabrication steps (oxide deposition, photolithography, etching) rather than using a single direct writing step. This segmentation allows each step to be optimized independently and executed in parallel, reducing overall manufacturing time while maintaining precision through the cumulative effect of controlled processes.
Solution Approach 2:
The invention uses photolithography to create a mask pattern that is then transferred to the oxide layer through etching. This copying approach using light-based photomasks enables rapid pattern reproduction without the time-consuming direct writing process, while maintaining high precision through the well-established photolithography methodology.
2Manufacturing precision
If conventional direct writing methods are used to manufacture imprinting templates, then pattern precision can be achieved, but manufacturing cost increases significantly
Solution Approach 1:
The invention utilizes standard semiconductor manufacturing equipment and processes (oxide deposition chambers, photolithography tools, etching reactors) that are already widely available in the semiconductor industry. This multi-functionality allows the same equipment to produce both semiconductor devices and imprinting templates, eliminating the need for specialized expensive equipment and reducing manufacturing costs while maintaining precision.
Solution Approach 2:
The invention employs consumable photomasks and standard semiconductor materials that can be easily replaced and are relatively inexpensive compared to specialized direct writing materials and equipment. The oxide layer serves as a disposable sacrificial material that is etched away to form the final template structure, reducing overall material costs.
3Manufacturing precision
If conventional methods are used to manufacture imprinting templates with high aspect ratio patterns, then deep profiles cannot be achieved, but increasing feature pitch is required
Solution Approach 1:
The invention changes the critical parameter from feature pitch to oxide layer thickness to control the depth of the imprinted pattern. By adjusting the oxide deposition thickness parameter, deep profiles with high aspect ratios can be achieved independently of the feature pitch, allowing fine pitch features to maintain small pitch while achieving great depth through controlled oxide layer thickness.
Solution Approach 2:
The invention transitions from controlling pattern depth through lateral feature dimensions to controlling it through the vertical oxide layer thickness dimension. This dimensional shift allows independent optimization of both pitch (lateral dimension) and depth (vertical dimension), enabling high aspect ratio patterns without compromising pitch.
4Use of energy by moving object
If surface roughening process is performed in LED manufacturing to increase light emission, then light emission from axial direction increases, but light dissipation occurs and emitting efficiency is damaged
Solution Approach 1:
The invention applies photonic crystal structures with specific local optical properties at the LED surface to control light emission directionally. Instead of uniform surface roughening that causes omnidirectional scattering and energy loss, the periodic photonic crystal structure creates localized optical effects that guide light emission preferentially in the axial direction, improving efficiency by reducing lateral light dissipation.
Solution Approach 2:
The invention uses composite photonic crystal structures combining materials with different refractive indices arranged in periodic patterns. This composite structure creates optical bandgaps and directional emission properties that enhance axial light extraction while minimizing energy loss to lateral directions, achieving both increased emission and reduced dissipation simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for rapid, economical, and mass production of imprinting templates with deep profiles, enabling the transfer of customized patterns to small devices and improving light-emitting efficiency in LED devices by reducing light dissipation.
Implementation Method 1
an oxide layer having a thickness in a range of 1000 angstroms to 8000 angstroms is formed on the substrate
Implementation Method 2
a microlithography and etch process is performed on the photoresist layer to form a pattern
Implementation Method 3
the oxide layer is etched through the openings to form a plurality of pillar-shaped holes
Data Source
AI summary
The method of manufacturing an imprinting template according to the present invention utilizes a semiconductor manufacturing process and comprises a step of etching an oxide layer having a thickness of from 1000 to 8000 angstroms on a substrate by a microlithography and etching process, to form a pattern having a plurality of pillar-shaped holes, thereby forming an imprinting plate having a plurality of pillar-shaped holes. A material layer may be filled into the holes and a part of the oxide layer is removed to form an imprinting template having a plurality of pillar-shaped protrusions. Alternatively, a silicon substrate may be used instead of the substrate and the oxide layer. The imprinting template according to the present invention has advantages of mass production, fast production, and low cost, and is suitable to serve as the imprinting plate for making photonic crystals.