IMR Conductive Line Integration for Antenna Yield

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Solution Overview

Problem

Conventional methods for manufacturing conductive lines in electronic devices, such as antennas, are complicated and costly due to the use of metal foils and in-mold foil/film processes, which hinder the simplification and downsizing of electronic device structures and result in low yield rates.

Innovation Solution

A manufacturing method involving the formation of a hardening layer and a conductive line layer on a carrier sheet, followed by an in-mold roller (IMR) process to integrate the conductive line onto a non-conductive substrate, with a connecting piece electrically connected to the conductive line layer, simplifying the process and enabling mass production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal foil is used to manufacture conventional antennas, then the antenna can be formed with basic conductivity, but the structure becomes too complicated and the thickness and overall size become too large

Engineering Contradiction:

Improveconductive functionVSAvoidantenna structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses a thin film structure with conductive patterns formed through IMR process to replace conventional metal foil antennas. The conductive line layer is embedded within a flexible substrate, achieving both conductivity and structural simplicity while reducing thickness and overall size of the antenna assembly.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs composite material structure consisting of conductive line layer, hardening layer, and flexible substrate combined through IMR process. This composite approach integrates multiple functions (conduction, structural support, flexibility) into a single streamlined component, reducing overall complexity compared to separate metal foil and support structures.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If IMF process is used to form circuit layout on casing, then the circuit can be integrated into the casing, but the procedures become too complicated and yield rate is difficult to control

Engineering Contradiction:

Improvecircuit integrationVSAvoidyield rate

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces the complex multi-step mechanical IMF process with an IMR (In-Mold Roller) process that integrates circuit formation into the molding operation itself. The conductive line layer is transferred onto the casing during the injection molding process, eliminating separate embedding steps and improving yield rate control through process integration.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If conventional antenna adhering method is used, then the antenna can be positioned at preset location, but the manufacturing cost increases and production scalability is limited

Engineering Contradiction:

Improveantenna positioningVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges the antenna formation process with the casing manufacturing process through IMR technology. The conductive line layer is transferred and positioned on the casing during the same molding cycle, eliminating separate antenna assembly steps. This integration maintains precise positioning while dramatically reducing manufacturing cost and enabling mass production scalability.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If complex antenna structure is used to achieve wireless communication function, then the communication function is realized, but the electronic device cannot be downsized

Engineering Contradiction:

Improvewireless communication functionVSAvoidelectronic device size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent uses thin film-based conductive patterns that can be conformally applied to the casing surface, enabling wireless communication functionality with minimal thickness. The flexible substrate allows the antenna to maintain electrical performance while occupying minimal volume, enabling device downsizing without compromising communication function.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS8973261B2Manufacturing method of object having conductive line

Publication Date: 2015.03.10 GETAC TECH CORP

AI summary

A manufacturing method of an object having a conductive line includes the following steps. A hardening layer and a conductive line layer are formed in an in-mold roller (IMR) material in sequence. The conductive line layer is formed on a non-conductive substrate by an IMR process. A carrier sheet is then separated to expose the hardening layer. A connecting piece is formed on the hardening layer. The connecting piece runs through the hardening layer by a connection process, and the connecting piece is electrically connected to the conductive line layer. Therefore, an object structure having the conductive line is formed.