Insulated Metal Substrate Bonding for Heat and Delamination Control
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Solution Overview
Problem
Current insulated metal substrates face issues with layer delamination and misalignment during high-temperature and high-power applications, particularly when using thick copper foils, leading to poor heat dissipation and mechanical processing challenges.
Innovation Solution
The development of an insulated metal substrate with a specific layered structure comprising an electrically conductive line pattern layer, encapsulation layer, and heat sink element, where adhesive layers with high bonding strength and glass transition temperature are used to ensure secure bonding and prevent delamination, along with a method involving CNC removal and hot-pressing to maintain alignment and bonding integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If DBC ceramic substrate is used to endure high temperature, then temperature resistance is improved, but mechanical processing difficulty increases and delamination occurs at high temperature
Solution Approach 1:
The patent uses a composite structure consisting of a ceramic layer bonded to a metal substrate (aluminum or copper). This composite material approach combines the high temperature resistance of ceramic with the mechanical properties and thermal conductivity of metal, allowing the substrate to withstand high temperatures while remaining processable and resistant to delamination.
2Power
If thicker copper foil is used for high power applications, then heat conduction capability is improved, but delamination between copper foil and ceramic layer occurs
Solution Approach 1:
The patent changes the material parameters by replacing the traditional ceramic-copper foil interface with a ceramic-metal substrate interface where the metal substrate has thermal expansion coefficients better matched to the ceramic. This parameter change in material selection prevents delamination even when thick copper foil is used for high power applications, as the metal substrate accommodates thermal stress better than ceramic alone.
3Area of stationary object
If hot-pressing is performed on heat dissipation fin with protrusions, then heat dissipation area is improved, but bonding strength between layers deteriorates due to non-uniform pressure
Solution Approach 1:
The patent performs preliminary actions by first forming the heat dissipation fin structure with protrusions, then applying a compliant adhesive layer that can conform to the non-uniform surface. The adhesive is applied before final bonding, allowing it to fill gaps and distribute pressure uniformly during subsequent hot-pressing, thus maintaining high bonding strength despite the complex fin geometry.
4Manufacturing precision
If misalignment of electrically conductive metal blocks occurs, then manufacturing precision deteriorates, but heat dissipation performance is reduced
Solution Approach 1:
The patent introduces an intermediary adhesive layer between the electrically conductive metal blocks and the substrate. This adhesive layer acts as a mediator that can accommodate minor misalignments while maintaining electrical and thermal contact. The adhesive fills gaps and ensures reliable bonding even when perfect alignment is not achieved, thus preserving heat dissipation performance despite reduced manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an insulated metal substrate with enhanced heat conductivity and high glass transition temperature, effectively addressing delamination and misalignment issues, ensuring reliable heat dissipation and mechanical stability in high-power applications.
Implementation Method 1
a first adhesive layer; a second adhesive layer... The first adhesive layer and the second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element
Implementation Method 2
the heat sink element... functions to dissipate heat... Heat could be dissipated downwards from the thermal conductive board to the below space
Implementation Method 3
a thermally conductive and electrically insulating layer... wherein a large amount of heat conductive fillers are evenly dispersed in this layer
Data Source
AI summary
An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.