IMS Thermalization Plate for Cryogenic RF Wireline Cooling

The patent introduces an intermediary thermalization structure consisting of a first section with high thermal conductivity material and a second section with low thermal conductivity material. This intermediary structure acts as a thermal mediator between the wireline and the cryocooled device, allowing electrical signal transmission while blocking thermal conduction paths. The first section provides efficient thermalization of the wireline to the cryocooled device temperature, while the second section minimizes heat transfer from warmer sections, thus resolving the contradiction between electrical connectivity and thermal isolation.

The patent divides the wireline into multiple thermal sections: a first section made of high thermal conductivity material for efficient thermalization, and a second section made of low thermal conductivity material for thermal isolation. This segmentation allows the wireline to be electrically connected while creating distinct thermal zones. The first section is thermally anchored to the cryocooled device temperature, while the second section prevents heat propagation from warmer external connections, thus maintaining low system temperature while enabling electrical connection.

The patent merges the thermalization function with the wireline structure itself by integrating the first and second sections directly into the connection path between the cryocooled device and external systems. Instead of adding separate thermal management components, the wireline is designed with composite material sections that perform both electrical conduction and thermal management functions. This merging approach achieves effective heat dissipation while minimizing additional device complexity.