Insulated Metal Substrate Assembly for Thick Copper Alignment
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Solution Overview
Problem
The difference in thermal expansion coefficients between ceramic and copper in direct bond copper (DBC) substrates leads to peeling issues under temperature tests, and increasing copper layer thickness for better heat dissipation complicates circuit pattern formation and alignment with insulating films.
Innovation Solution
An insulated metal substrate comprising a metal substrate, an insulating layer, and conductive metal pads surrounded by a plastic frame with identical thickness, which is formed through injection molding and stamping to ensure tight lamination and alignment, reducing the need for soldering layers and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the copper layer is increased to enhance heat dissipation uniformity, then heat dissipation performance is improved, but circuit pattern formation becomes difficult and alignment with insulating film becomes complicated
Solution Approach 1:
The patent changes the material parameter from traditional thin copper foil to thick copper plate (1-5mm thickness). This parameter change enables improved heat dissipation uniformity while the invention provides new manufacturing methods (stamping, cutting, folding) that resolve the circuit pattern formation difficulty associated with thick copper
Solution Approach 2:
The patent segments the thick copper layer into multiple blocks when necessary, allowing each block to be manufactured and positioned separately. This segmentation makes it feasible to work with thick copper that would otherwise be too rigid and difficult to form into continuous circuit patterns
Solution Approach 3:
The patent introduces a plastic frame as an intermediary component that surrounds and positions the copper blocks. This plastic frame facilitates the alignment and bonding process between thick copper blocks and insulating films, resolving the alignment complexity issue
2Reliability
If ceramic is replaced by insulating film to avoid thermal expansion mismatch, then peeling issue is reduced, but heat dissipation capability is insufficient requiring increased copper thickness
Solution Approach 1:
The patent uses a composite structure combining thick copper (1-5mm) for heat dissipation with insulating film for electrical isolation and plastic frame for structural support. This composite approach allows the copper to provide superior heat dissipation while the insulating film and plastic frame handle mechanical and electrical isolation functions
Solution Approach 2:
The patent dramatically increases the copper thickness parameter from conventional thin foil to 1-5mm thick copper plate. This parameter change provides sufficient heat dissipation capability, and the invention compensates for the manufacturing challenges by using stamping, cutting, and folding techniques
3Temperature
If thick copper layer is used for heat dissipation, then heat dissipation uniformity is enhanced, but the copper layer is pressed into blocks and misalignment occurs during assembly
Solution Approach 1:
The patent introduces a plastic frame as an intermediary positioning structure that surrounds each copper block. This plastic frame serves as a precision guide and spacer, ensuring accurate alignment between copper blocks and insulating films during assembly, thereby preventing misalignment issues
Solution Approach 2:
The patent segments the thick copper layer into multiple discrete blocks that can be individually manufactured and positioned. This segmentation, combined with the plastic frame positioning system, allows for precise alignment control of each block, maintaining manufacturing precision despite the thickness of the copper
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability and alignment of the substrate, reduces manufacturing costs by eliminating soldering layers, and maintains structural integrity under temperature tests.
Implementation Method 1
The conductive metal pads are surrounded and restrained by the plastic frame
Implementation Method 2
the plastic frame's insulating and temperature-resistant properties match those of the metal and insulating layers
Implementation Method 3
enhance uniformity of heat dissipation
Data Source
AI summary
An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.