Inertial Measurement Module Thermal Stress Reduction
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Solution Overview
Problem
The existing inertial measurement assembly in UAVs experiences stress changes due to temperature fluctuations, leading to inaccuracies and instability in flight control.
Innovation Solution
An inertial measurement module is designed with a thermally conductive member that abuts against both the thermal resistor and the inertial measurement unit, ensuring effective heat transfer while maintaining a preset distance from the cover plate, thereby preventing contact and squeeze issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermally conductive material directly covers the thermal resistor and inertial measurement body and is held through engagement of upper shell and lower shell, then heat transfer efficiency is improved, but squeeze exists between the thermally conductive material and the inertial measurement body causing stress changes
Solution Approach 1:
The patent divides the thermal conduction structure into separate components: the thermally conductive material is detached from the inertial measurement body and positioned independently in the receiving space. This segmentation eliminates direct contact and squeeze between the thermally conductive material and the inertial measurement body, while still allowing effective heat transfer through the thermally conductive material's proximity to both the thermal resistor and inertial measurement body.
Solution Approach 2:
The patent introduces the cover plate with a first groove as an intermediary structure. The first groove receives the thermally conductive material and positions it at a preset distance from the bottom surface, acting as a mediator that prevents direct squeeze on the inertial measurement body while maintaining thermal conduction path from the thermal resistor to the inertial measurement body.
2Stability of the object's composition
If the thermally conductive material is held through engagement of upper shell and lower shell, then structural stability is improved, but the inertial measurement body experiences stress changes during flight
Solution Approach 1:
The patent segments the structural engagement system by separating the thermally conductive material from the inertial measurement body. The thermally conductive material is held by the cover plate and mount structure independently, eliminating direct mechanical coupling that causes stress changes during flight while maintaining structural stability through the segmented support system.
Solution Approach 2:
The cover plate with the first groove serves as an intermediary that decouples the thermal conduction function from the mechanical support function. This intermediary structure allows the thermally conductive material to be held stably while preventing it from transmitting stress changes to the inertial measurement body, thereby maintaining flight control accuracy.
3Temperature
If the thermally conductive material directly contacts the inertial measurement body, then heat transfer is improved, but squeeze exists causing inaccuracy and instability
Solution Approach 1:
The patent segments the contact interface by positioning the thermally conductive material at a preset distance from the inertial measurement body through the first groove structure. This segmentation maintains effective heat transfer through thermal conduction while eliminating direct mechanical contact that causes squeeze and measurement inaccuracy.
Solution Approach 2:
The first groove in the cover plate acts as an intermediary structure that mediates between the thermally conductive material and the inertial measurement body. It allows thermal energy to transfer effectively while preventing mechanical squeeze, thereby maintaining measurement precision and flight control accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces or prevents stress changes in the inertial measurement unit caused by temperature changes, enhancing the accuracy and stability of flight control and facilitating easier usage.
Implementation Method 1
the thermally conductive member is configured to abut against the thermal resistor and the inertial measurement unit, so that heat generated by the thermal resistor is transferred to the inertial measurement unit
Data Source
AI summary
Embodiments of the present invention is an inertial measurement module, including a mount, a circuit board, a thermally conductive member and a cover plate mounted to the mount. The circuit board is mounted to an end surface of the mount, and is configured to mount an inertial measurement assembly and the thermally conductive member. The inertial measurement assembly includes a thermal resistor and an inertial measurement unit. The thermally conductive member is configured to abut against the thermal resistor and the inertial measurement unit. A surface of the cover plate is provided with a first groove. A receiving space is formed by the first groove and the surface of the mount. The circuit board and the thermally conductive member are both received in the receiving space. The thermally conductive member is arranged at a preset distance from a bottom of the first groove.