IMU PCB Structural Rigidity Against Vibration Deformation

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Solution Overview

Problem

Micro Inertial Measurement Units (IMUs) face measurement accuracy issues due to mechanical deformation of PCBs under vibrational movements, which can misorient or damage MEMS components.

Innovation Solution

The configuration of multiple circuit boards arranged in perpendicular positions, with at least three vertical PCBs attached to a horizontal PCB, enhances structural rigidity and reduces deformation by forming a U-shape or rectangle/square structure, ensuring multi-axis detection and improved reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If three one-axis gyroscopes are arranged on three separate PCBs that are perpendicular to each other, then multi-axis detection capability is achieved, but mechanical deformation of the PCBs under vibrational movements causes misorientation or damage to the MEMS components, deteriorating measurement accuracy

Engineering Contradiction:
Improvemulti-axis detection capabilityVSAvoidmeasurement accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent merges multiple PCBs into a single integrated support structure. Instead of using three separate PCBs perpendicular to each other, the invention integrates them into one rigid support that holds all gyroscopes, eliminating relative movement and deformation between PCBs while maintaining multi-axis detection capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a composite support structure combining rigid materials to create a stable mounting platform. The support structure is designed as a rigid assembly that resists vibrational deformation, providing stable mechanical support for all MEMS gyroscopes across multiple axes.

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If multiple separate PCBs are used to mount MEMS components for multi-axis detection, then detection coverage is improved, but the structural rigidity is reduced causing deformation under vibrational movements

Engineering Contradiction:
Improvedetection coverageVSAvoidstructural rigidity
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent combines multiple PCB functions into a single integrated support structure. This unified structure provides the necessary structural rigidity to resist vibrational movements while still accommodating MEMS components for multi-axis detection through its integrated design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a planar PCB arrangement to a three-dimensional integrated support structure. This dimensional change allows the support to span multiple axes and provide rigid structural support in all directions while maintaining detection coverage for multi-axis gyroscopes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If PCBs are arranged in perpendicular positions for multi-axis gyroscope mounting, then multi-axis detection is enabled, but the complexity of the device structure increases

Engineering Contradiction:
Improvemulti-axis detectionVSAvoidstructural complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent reduces structural complexity by merging multiple separate PCB assemblies into a single integrated support structure. This consolidation simplifies the overall device architecture while maintaining the capability to mount and detect signals from multi-axis gyroscopes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated support structure serves multiple functions simultaneously: it provides mechanical support for all gyroscopes, maintains precise spatial relationships between components, and enables multi-axis detection. This multi-functionality reduces the need for separate structural elements, thereby simplifying the overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240147623A1Electronic device
Publication Date: 2024.05.02 MURATA MFG CO LTD
  • US20240147623A1 patent drawing
  • US20240147623A1 patent drawing
  • US20240147623A1 patent drawing

AI summary

An arrangement is provided reduces deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.