IMU Electronic Structure With Segmented Bonding for Thermal Isolation
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Solution Overview
Problem
Existing physical quantity sensors using silicon micro electro mechanical system (MEMS) technology face issues with heat transfer from circuit elements to sensor elements, leading to temperature drift and signal fluctuations, which affect accuracy.
Innovation Solution
The electronic structure incorporates a coupling mechanism with protrusion groups and gaps between a circuit element and a functional element, promoting gas flow and improving heat insulation, thereby reducing temperature drift.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is formed over the entire lower surface of the circuit element to adhere it onto the sensor element, then the circuit element is firmly attached to the sensor element, but heat generated in the circuit element is easily transferred to the sensor element causing temperature drift and signal fluctuations
Solution Approach 1:
The adhesive layer is segmented into isolated adhesive regions rather than forming a continuous layer. Multiple discrete adhesive regions are distributed across the circuit element's lower surface, providing sufficient bonding strength while creating air gaps that act as thermal barriers to reduce heat transfer to the sensor element.
Solution Approach 2:
The adhesive layer has non-uniform distribution with different properties in different locations. Adhesive material is strategically placed only in specific regions where bonding is needed, while leaving other regions as air gaps for thermal insulation. This local differentiation optimizes both bonding strength and heat rejection.
2Ease of manufacture
If the circuit element is directly adhered onto the sensor element using a continuous adhesive layer, then assembly is simple and manufacturing is easy, but heat transfer causes deterioration of sensor output accuracy
Solution Approach 1:
The adhesive layer is divided into multiple discrete regions rather than forming a continuous layer. This segmentation can be achieved through standard manufacturing techniques such as photolithography patterning or selective dispensing, maintaining ease of manufacture while creating thermal barriers that protect sensor output accuracy from heat-induced drift.
3Strength
If a continuous adhesive layer is used to bond the circuit element to the sensor element, then the bonding area is maximized for strong attachment, but the heat transfer path is also maximized leading to temperature drift
Solution Approach 1:
The adhesive layer is segmented into multiple discrete regions distributed across the bonding interface. This segmentation reduces the total adhesive bonding area while maintaining sufficient attachment strength through distributed bonding points, and simultaneously creates air gaps that act as thermal barriers to reduce heat transfer energy from the circuit element to the sensor element.
Solution Approach 2:
Air gaps between the circuit element and sensor element serve as intermediary thermal barriers. These air regions mediate the thermal interaction by providing high thermal resistance, reducing the rate of heat transfer energy from the heat-generating circuit element to the temperature-sensitive sensor element while still allowing mechanical bonding through the adhesive regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces heat transfer and temperature drift, enhancing the accuracy and stability of sensor outputs by facilitating better heat insulation between the circuit and functional elements.
Implementation Method 1
a gap is provided between the first protrusion group and the second protrusion group, and the gap includes a first space provided from an end of the circuit element on a negative side of the X-axis to an end of the circuit element on a positive side of the X-axis
Implementation Method 2
there is a concern that heat generated in the circuit element will be easily transferred to the sensor element... This design effectively reduces heat transfer and temperature drift, enhancing the accuracy and stability of sensor outputs by facilitating better heat insulation between the circuit and functional elements
Data Source
AI summary
An electronic structure includes a circuit element, and a functional element disposed at a position overlapping the circuit element in a plan view in a Z-axis direction along a Z-axis, where three mutually orthogonal axes are an X-axis, a Y-axis, and the Z-axis, in which, between the circuit element and the functional element, a first protrusion group including a plurality of first protrusions disposed in an X-axis direction along the X-axis and a second protrusion group including a plurality of second protrusions disposed in the X-axis direction are provided, the circuit element and the functional element are coupled through the first protrusion group and the second protrusion group, a gap is provided between the first protrusion group and the second protrusion group, and the gap includes a first space provided from an end of the circuit element on a negative side of the X-axis to an end of the circuit element on a positive side of the X-axis.