In-Chip Heat Sink Layout for Stacked Die Thermal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip packaging schemes face challenges in heat transfer limitations, particularly when a heat-generating die is stacked below other dies, leading to reduced design flexibility and performance due to thermal budgets limiting power consumption and IC die placement.
Innovation Solution
Incorporation of an in-chip heat sink within the IC die that separates high and low heat-generating circuits, utilizing metal layers to form a thermally conductive barrier and facilitate efficient heat transfer out of the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a heat-generating die is stacked below other dies in conventional chip packaging, then component density is improved, but heat transfer capability deteriorates
Solution Approach 1:
The die is segmented into multiple functional regions by introducing an in-chip heat sink structure that divides the die body into a heat-generating circuit region and a non-heat-generating circuit region. This segmentation allows independent thermal management of different circuit areas, enabling high component density while maintaining effective heat transfer paths.
Solution Approach 2:
An in-chip heat sink is introduced as an intermediary thermal management structure within the die. This heat sink acts as a mediator between the heat-generating circuits and the die substrate, providing a dedicated heat transfer pathway that does not interfere with the stacking arrangement, thus maintaining both high component density and effective heat dissipation.
2Temperature
If an in-chip heat sink is introduced to improve heat transfer, then heat transfer capability is improved, but device complexity increases
Solution Approach 1:
The in-chip heat sink is merged with the die substrate structure, forming an integrated thermal management solution. The heat sink is constructed using the same semiconductor fabrication processes as the circuits themselves, combining the thermal management function with the existing die structure rather than adding a separate component, thus improving heat transfer while minimizing increases in device complexity.
Solution Approach 2:
The in-chip heat sink structure serves multiple functions: it provides thermal management for heat-generating circuits, acts as a physical separator between different circuit regions, and maintains structural integrity of the die. This multi-functionality reduces the need for additional separate components, balancing improved heat transfer capability with acceptable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The in-chip heat sink effectively reduces lateral heat transfer, allowing high-powered circuits to operate without overheating neighboring circuits, enhancing performance and design flexibility while maintaining efficient heat dissipation.
Implementation Method 1
The in-chip heat sink has a ring-shape and an orientation extending between the upper surface and the lower surface of the die body. The in-chip heat sink separates the first circuit from the second circuit.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A method and apparatus are provided that includes an integrated circuit die 114, 116 having an in-chip heat sink 112, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die 114, 116 has an in-chip heat sink 112 that separates a high heat generating integrated circuit device from another integrated circuit device disposed within the die 114, 116. The in-chip heat sink 112 provides a highly conductive heat transfer path from interior portions of the die 114, 116 to at least one exposed die surface.