In-Memory Logic and Sense Amplifier Architecture for Low-Latency Computing
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Solution Overview
Problem
Existing memory devices face inefficiencies in processing performance and power consumption due to the need for external communication between processing resources and memory arrays, which can be addressed by integrating processing capabilities directly within the memory array to reduce latency and bandwidth requirements.
Innovation Solution
The integration of logic components within memory devices, utilizing through silicon vias for enhanced signaling, allows for partitioned logic operations to be performed directly on memory components, reducing the need for external processing resources and enabling faster, more efficient logical operations within the memory array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If processing resources are external to the memory array, then device complexity is reduced, but processing performance and speed deteriorate due to external communication overhead
Solution Approach 1:
The patent combines processing resources (logic components) directly within the memory array structure, merging previously separate memory and processing functions into a unified integrated device. This allows logic operations to be performed on data while it resides in memory, eliminating the need for data to be transferred to external processing units and back, thereby significantly improving processing speed while maintaining manageable device complexity through systematic integration.
2Productivity
If logic components are integrated within the memory array, then processing performance improves, but device complexity increases
Solution Approach 1:
The integrated logic components within the memory array are designed to perform multiple functions: they can execute logical operations (AND, OR, NOT, NAND, NOR, XOR) on data stored in the memory array, control memory access operations, and manage data flow between memory banks. This multi-functionality allows a single integrated structure to replace what would otherwise require separate memory devices and external processing units, improving processing performance while controlling device complexity through functional consolidation.
3Ease of operation
If data is accessed via external bus, then ease of operation is maintained, but loss of time increases due to communication latency
Solution Approach 1:
The patent extracts the processing function from external bus communication and embeds it directly within the memory array through integrated logic components. This extraction eliminates the time-consuming data transfer cycle between external memory and processing units, allowing logical operations to be performed in-place on stored data. The ease of operation is maintained through standardized interfaces, while communication latency is dramatically reduced by performing operations where data already resides.
4Manufacturing precision
If processing resources are external, then manufacturing precision requirements are reduced, but productivity deteriorates due to bandwidth limitations
Solution Approach 1:
The patent transitions from a two-dimensional external architecture (separate memory and processing units connected via bus) to a three-dimensional integrated structure where logic components are embedded within the memory array fabric. This dimensional change enables direct coupling between storage and processing elements, eliminating bandwidth limitations of external buses and dramatically improving productivity through parallel in-memory computing operations, while manufacturing precision is managed through established semiconductor integration techniques.
Data Source
AI summary
Apparatuses and methods are provided for logic/memory devices. An example apparatus comprises a plurality of memory components adjacent to and coupled to one another. A logic component is coupled to the plurality of memory components. At least one memory component comprises a memory device having an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry includes a sense amplifier and a compute component. Timing circuitry is coupled to the array and sensing circuitry and configured to control timing of operations for the sensing circuitry. The logic component comprises control logic coupled to the timing circuitry. The control logic is configured to execute instructions to cause the sensing circuitry to perform the operations.