In-Memory Signed Division via Sensing Circuitry

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Solution Overview

Problem

Existing semiconductor memory systems face inefficiencies in performing signed division operations, particularly due to the need to transfer data between memory arrays and processing resources, which consumes significant power and time, and are limited by the mismatch in pitch between memory cells and processing circuitry.

Innovation Solution

The implementation of sensing circuitry within the memory array that can perform signed division operations on bit-vectors without transferring data via input/output lines, using operations like AND, OR, SHIFT, and INVERT, and being formed on the same pitch as complementary sense lines to reduce computations and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If data is transferred between memory arrays and processing resources via input/output lines, then signed division operations can be performed, but power consumption and time increase significantly

Engineering Contradiction:
Improvepower consumptionVSAvoiddivision operation efficiency
Core Design Contradiction:
PowerVSProductivity

Solution Approach 1:

The patent merges the processing function with the memory array by implementing sensing circuitry that can perform signed division operations directly within the memory array structure. This eliminates the need for separate processing resources and data transfer via input/output lines, thereby reducing power consumption while maintaining division operation efficiency through in-memory computation.

Inventive Principle:
Principle #5Merging (Combining)

2Loss of time

If data is transferred between memory arrays and processing resources, then signed division operations can be executed, but time consumption increases

Engineering Contradiction:
Improvetime consumptionVSAvoiddivision operation throughput
Core Design Contradiction:
Loss of timeVSProductivity

Solution Approach 1:

The patent combines the division operation functionality directly into the memory array through sensing circuitry, eliminating the time-consuming data transfer process between memory arrays and external processing resources. This in-memory computation approach significantly reduces time consumption while maintaining high division operation throughput.

Inventive Principle:
Principle #5Merging (Combining)

3Productivity

If sensing circuitry is formed on the same pitch as complementary sense lines, then computational efficiency improves, but device complexity increases

Engineering Contradiction:
Improvecomputational efficiencyVSAvoidsensing circuitry structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The sensing circuitry is designed to perform multiple functions including data sensing and signed division operations using a unified structure formed on the same pitch as complementary sense lines. This multi-functional design improves computational efficiency by eliminating the need for separate processing resources while the structured approach to circuit design helps manage device complexity through systematic integration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10540144B2Signed division in memory
Publication Date: 2020.01.21 MICRON TECHNOLOGY INC
  • US10540144B2 patent drawing
  • US10540144B2 patent drawing
  • US10540144B2 patent drawing

AI summary

Examples of the present disclosure provide apparatuses and methods for performing signed division operations. An apparatus can include a first group of memory cells coupled to a sense line and to a number of first access lines. The apparatus can include a second group of memory cells coupled to the sense line and to a number of second access lines. The apparatus can include a controller configured to operate sensing circuitry to divide a signed dividend element stored in the first group of memory cells by a signed divisor element stored in the second group of memory cells by performing a number of operations.