In-Mold Electronics for Vehicle Exterior Parts

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Solution Overview

Problem

Molded parts in vehicles often lack functionality and require complex structures to accommodate functional components, which add weight and bulk, and are not adequately protected from environmental factors.

Innovation Solution

In-mold integration of functional components, such as electronic circuits, within the molded parts using thermoformed films and structural layers, eliminating the need for additional components for protection and waterproofing, and allowing for fewer moving parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If functional components are affixed to molded parts, then functionality is improved, but device complexity increases

Engineering Contradiction:
ImprovefunctionalityVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the molded part and functional component into a single integrated unit. The functional component is embedded within the molded part during the molding process, eliminating the need for separate affixing structures. This merging reduces overall device complexity while maintaining functionality, as the functional component becomes an inherent part of the molded structure rather than an add-on element.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If complex structures are used to protect functional components, then reliability is improved, but weight increases

Engineering Contradiction:
Improveprotection from environmental factorsVSAvoidvehicle weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The protective structure is merged with the molded part itself. The functional component is encapsulated within the molded part, which serves as both the structural element and the protective housing. This integration eliminates the need for separate protective structures, reducing weight while maintaining protection against environmental factors such as moisture, dust, and physical impact.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The molded part acts as a thin-walled protective shell that encloses the functional component. This shell provides environmental protection through its sealed structure, preventing ingress of moisture and contaminants. The thin-walled design minimizes added weight compared to bulky protective structures, achieving effective protection with minimal mass penalty.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If complex structures are used to accommodate functional components, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveprotection from impactVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The structural support and protective housing functions are merged into the molded part. The functional component is embedded within the molded part, which provides both structural support and impact protection. This integration eliminates the need for separate mounting brackets, protective housings, and waterproofing components, significantly reducing structural complexity while maintaining reliable protection against impact and environmental factors.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces weight and complexity while providing embedded protection for functional components, enabling vehicles to operate in more challenging environments and terrains without the need for additional structural elements.

Implementation Method 1

The molded part includes a thermoformed first film, a molded structural layer, and a thermoformed second film

Methodology Applied
Scientific EffectThermoforming:

Data Source

PatentUS10899299B1In-mold electronics within vehicle exterior
Publication Date: 2021.01.26 HONDA MOTOR CO LTD
  • US10899299B1 patent drawing
  • US10899299B1 patent drawing
  • US10899299B1 patent drawing

AI summary

A vehicle having in-mold electronics is provided. According to one or more aspects, a vehicle includes a vehicle computing device, for controlling the vehicle, and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the vehicle computing device. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part that forms an exterior portion of the vehicle.