In-Mold RFID Antenna Tag Structure for Bubble-Free Labeling
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Solution Overview
Problem
Existing RFID labels, particularly UHF RFID labels, are not compatible with materials used in in-mold labeling, leading to defects such as bubbles and poor optical quality during molding, and adapting the substrate material to comply with in-mold materials results in high fabrication costs and small process windows.
Innovation Solution
An antenna tag element for in-mold labeling comprising a carrier frame sheet body with a cut-out portion and an antenna pattern formed on its surface, laminated with a compatible lamination material, reducing the surface area and minimizing adhesive use to prevent defects during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If RFID labels are used in in-mold labeling, then tracking and monitoring capabilities are improved, but defects like bubbles and poor optical quality occur during molding
Solution Approach 1:
The patent extracts the problematic substrate material from the RFID label structure and replaces it with a compatible in-mold labeling material. The antenna pattern is retained and integrated into the new substrate, which is designed to be compatible with injection molding processes, thereby eliminating bubble formation while preserving RFID functionality.
Solution Approach 2:
The patent creates a composite structure where the antenna pattern (conductive material) is integrated with a compatible substrate material that is suitable for in-mold labeling. This composite approach allows the RFID functionality to be maintained while the substrate material compatibility ensures defect-free molding and good optical quality.
2Adaptability or versatility
If substrate material is adapted to comply with in-mold materials, then compatibility is improved, but fabrication costs increase and process windows decrease
Solution Approach 1:
The patent employs a substrate material that serves multiple functions: it is compatible with in-mold labeling processes, provides structural support for the antenna pattern, and enables defect-free molding. This universal material eliminates the need for specialized adaptations, thereby reducing fabrication costs and simplifying the manufacturing process.
3Reliability
If label material compatibility with plastic material is ensured, then adhesion quality is improved, but material selection is restricted
Solution Approach 1:
The patent changes the substrate material parameters to match the chemical and physical properties of the plastic material being molded. By selecting a substrate with compatible thermal, chemical, and mechanical properties, the patent ensures strong adhesion and prevents defects like warping and bubbles, while the design allows integration with various plastic materials through parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution avoids defects like bubbles and improves bonding quality, ensuring high-quality in-mold labels without increasing fabrication costs, and is compatible with materials like polyolefine, polypropylene, and polyethylene.
Implementation Method 1
The carrier frame sheet body with the antenna pattern is laminated into a lamination material over the main surfaces of the carrier frame sheet body, the lamination material at least partially filling the at least one cut-out portion
Data Source
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Figure 5a~5b
AI summary
In some illustrative embodiments, an antenna tag element for in-mold labeling is provided. The antenna tag element comprises a carrier frame sheet body with an antenna pattern formed on at least one main surface of the carrier-frame body, wherein the carrier frame sheet body has at least one cut-out portion completely removing carrier frame sheet body material between the main surfaces of the body and being completely surrounded by the carrier frame sheet body. The antenna pattern is formed of an electrically conductive material formed on at least one of the main surfaces of the carrier frame sheet body, wherein the antenna pattern has at least one loop portion which surrounds at least one of the at least one cut-out portions. The carrier frame sheet body with the antenna pattern is laminated into a lamination material over the main surfaces of the carrier frame sheet body, the lamination material at least partially filling the at least one cut-out portion.