In-Molded Film Control Panel Assembly With Encapsulated Printed Circuits

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Solution Overview

Problem

Conventional control panel assemblies are complex and costly due to multiple components and potential failure points, especially in small or uniquely shaped products with complex controls, leading to high manufacturing expenses and reliability issues.

Innovation Solution

A simplified control panel assembly is created by bonding two film layers to either side of an injection molded resin, with one film having a printed circuit and surface-mounted electronic components, and the other film decorated with capacitive touch sensors and other features, which are fully encapsulated by the resin for protection and integrated circuit termination for direct connection to control boards or power sources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple separate components (control panel, housing, PCB, interconnects) are used in conventional assemblies, then functional requirements can be met, but device complexity and manufacturing cost increase significantly

Engineering Contradiction:

Improvefunctional requirementsVSAvoidnumber of components

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the control panel, housing, PCB, and interconnects into a single integrated injection-molded component. The control panel assembly includes integrated circuit boards with electronic components mounted directly on them, eliminating the need for separate housings and interconnect wires. This consolidation reduces device complexity while maintaining all necessary functional requirements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated control panel assembly serves multiple functions simultaneously: it provides the user interface, houses the electronic circuitry, provides structural support, and enables interconnections all within a single component. This multi-functionality eliminates the need for separate dedicated components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple separate components and interconnects are used, then functional requirements can be met, but manufacturing cost increases due to assembly complexity

Engineering Contradiction:

Improvefunctional requirementsVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple manufacturing steps and components into a single injection molding process. The control panel, housing, and circuit board supports are all formed in one molding cycle, eliminating subsequent assembly operations. This significantly reduces manufacturing cost by eliminating labor-intensive assembly steps and reducing the number of separate parts that need to be manufactured and assembled.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If multiple separate components and interconnects are used, then functional requirements can be met, but reliability decreases due to multiple potential failure points

Engineering Contradiction:

Improvefunctional requirementsVSAvoidfailure points

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent integrates all critical components into a single monolithic structure formed by injection molding. The circuit boards are supported directly by the molded housing structure, eliminating interconnect wires and separate mounting hardware. This integration eliminates multiple potential failure points associated with connections between separate components, thereby improving reliability while maintaining all functional requirements.

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If conventional separate component assemblies are used, then functional requirements can be met, but assembly time and production efficiency decrease

Engineering Contradiction:

Improvefunctional requirementsVSAvoidassembly time

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent consolidates multiple assembly operations into a single injection molding process. The control panel, housing, and circuit board supports are all formed simultaneously in one molding cycle, eliminating subsequent assembly steps. This dramatically reduces assembly time and increases production efficiency while maintaining all necessary functional requirements.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces complexity and cost, enhances reliability by minimizing failure points, and provides protection against moisture, corrosion, and physical damage, resulting in a more robust and cost-effective control panel.

Implementation Method 1

molten resin is injected in between the 2 films completely encapsulating both the second surface decoration on the A side film and the conductive circuit with the mounted components on the B side of the molded article

Methodology Applied

Scientific EffectInjection molding:

Data Source

PatentUS8804344B2Injection molded control panel with in-molded decorated plastic film

Publication Date: 2014.08.12 E2IP TECH INC

AI summary

Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.