In-Molded Control Panel Assembly With Integral Connector and PCB
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Solution Overview
Problem
Conventional control panel assemblies in injection molding are complex and costly due to multiple components and potential failure points, especially in small or uniquely shaped products with complex controls, leading to high manufacturing expenses and reliability issues.
Innovation Solution
A simplified control panel assembly is achieved by bonding two film layers to either side of an injection molded resin, with one layer featuring an in-molded decorative surface and the other a printed circuit containing capacitive touch sensors, electronic components, and a connector that remains integral for direct interconnection, ensuring protection from environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple separate components (control panel, housing, PCB, interconnect wires) are used in conventional assemblies, then functional requirements can be met, but manufacturing cost and assembly complexity increase significantly
Solution Approach 1:
The patent merges the control panel, housing, PCB, and interconnect wires into a single integrated injection-molded component. The control panel forms the front face of the housing, circuit boards are embedded within the housing during molding, and interconnect wires are pre-positioned and encapsulated within the molded material, eliminating the need for separate assembly steps and reducing part count to one.
Solution Approach 2:
The single molded component performs multiple functions simultaneously: the control panel provides user interface functionality, the housing provides structural support and enclosure, the embedded PCB provides circuit functionality, and the encapsulated wires provide electrical interconnection. This multi-functional integration eliminates the need for separate components.
2Reliability
If multiple separate components and interconnects are used, then functional requirements can be met, but the number of potential failure points increases
Solution Approach 1:
By merging all components into a single integrated molded part, the patent eliminates the interfaces and connections between separate components that serve as failure points. The encapsulation of wires within the molded material protects them from environmental damage and mechanical stress, while the integration eliminates connection points where failures could occur.
3Productivity
If conventional separate component assembly is used, then functional requirements can be met, but assembly time and manufacturing complexity increase
Solution Approach 1:
The patent performs preliminary actions during the injection molding process itself: circuit boards are positioned and embedded within the housing before the final set, interconnect wires are pre-positioned and encapsulated within the molded material, and all components are integrated in a single molding cycle. This eliminates the need for subsequent assembly operations.
4Shape
If in-molded decorative film is added to control panels, then aesthetic requirements are met, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the decorative film integration with the circuit board embedding and wire encapsulation processes. All these features are achieved simultaneously through a single modified injection molding operation, where the decorative film is placed in the mold cavity, components are positioned, and molten material is injected to encapsulate everything in one step.
Data Source
Figure 1
Figure 2A~3B
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AI summary
Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.