In-Package Microelectronic Amplifier Signal Noise Reduction
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Solution Overview
Problem
Existing sensor module designs on printed circuit boards face significant signal noise and reduced electronic bandwidth due to the distance between amplifiers and sensors, which is exacerbated by pin capacitance from numerous electrical connections.
Innovation Solution
Integrating an amplifier within the sensor module on a package substrate, electrically connected to the sensor and equipped with electrical traces for signal routing, eliminates pin capacitance and reduces signal loss by minimizing the distance signals need to travel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If amplifiers are mounted on the printed circuit board outside the sensor module, then the sensor module can be kept compact, but pin capacitance increases and degrades noise performance and reduces electronic bandwidth
Solution Approach 1:
The patent merges the amplifier with the sensor module by integrating it into the same package substrate. The amplifier is electrically connected to the sensor through traces on the package substrate, eliminating the need for external PCB mounting and associated pin capacitance. This combining of sensor and amplifier within the same package resolves the contradiction by maintaining compact size while improving noise performance.
2Reliability
If amplifiers are placed close to sensors within the sensor module, then noise performance improves and pin capacitance is eliminated, but the device complexity increases
Solution Approach 1:
The sensor and amplifier are integrated on the same package substrate, sharing common electrical interconnects and packaging infrastructure. This merging approach improves noise performance by eliminating external pin capacitance while managing complexity through shared structural elements and standardized integration processes.
3Ease of manufacture
If amplifiers are mounted on the printed circuit board, then device complexity is reduced and ease of manufacture is improved, but signal loss increases due to longer trace lengths and pin capacitance
Solution Approach 1:
By integrating the amplifier directly on the sensor module's package substrate, the patent minimizes signal path length and eliminates external pin capacitance that causes signal loss. The short internal traces on the package substrate reduce signal degradation while the integrated design maintains manufacturing efficiency through consolidated assembly processes.
Data Source
AI summary
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.