In-Package Sequencer for Memory Sub-System Signal Integrity
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Solution Overview
Problem
Conventional memory sub-systems face challenges with increased capacity due to the need for a large number of pins in controllers, leading to larger form factors, compromised signal integrity, and higher power consumption, as the sequencer component is typically integrated within the controller and interfaces with multiple memory components using parallel interfaces.
Innovation Solution
The sequencer component is separated from the controller and integrated within the same package as the memory components, using a SerDes connection for higher bandwidth and reduced pin count, allowing for independent operation with multiple memory types and improved signal integrity through shorter trace lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the sequencer component is integrated within the controller and uses parallel interfaces to interface with multiple memory components, then the controller can maintain compatibility with conventional memory architectures, but the form factor increases, signal integrity is compromised, and power consumption increases due to the large number of pins required
Solution Approach 1:
The patent segments the memory sub-system into distinct functional packages: a controller package containing the controller, and separate memory component packages containing memory components and sequencer components. This segmentation allows the controller to use fewer pins while maintaining functionality through standardized interfaces.
Solution Approach 2:
The patent introduces sequencer components as intermediary elements between the controller and memory components. These sequencers handle protocol conversion and command sequencing, enabling the controller to communicate with multiple memory components using fewer pins while maintaining compatibility with conventional memory architectures.
2Ease of operation
If the sequencer component is integrated within the controller and uses parallel interfaces, then the controller can interface with multiple memory components, but signal integrity is compromised due to longer trace lengths
Solution Approach 1:
The patent divides the system into separate packages where memory components and their associated sequencers are grouped together. This segmentation shortens the trace lengths between the sequencer and memory components within each package, improving signal integrity while maintaining the ability to interface with multiple memory components through the controller.
Solution Approach 2:
The sequencer acts as an intermediary that receives commands from the controller and translates them into appropriate signals for the memory components. This intermediary function allows the use of shorter, higher-integrity traces within the memory package while maintaining comprehensive interface capability through the controller-sequencer connection.
3Ease of operation
If the sequencer component is integrated within the controller and uses parallel interfaces, then the controller can support multiple memory components, but power consumption increases due to the large number of pins
Solution Approach 1:
The patent segments the functionality into separate packages, reducing the pin count required in the controller. By placing sequencers in separate memory component packages, the controller uses fewer pins to communicate with multiple memory components, thereby reducing power consumption associated with pin switching and signal driving while maintaining support for multiple memory components.
Solution Approach 2:
The sequencer serves as an intermediary that consolidates communication pathways. Instead of the controller directly interfacing with each memory component requiring multiple pins per component, the sequencer manages multiple memory components through a single connection point, reducing the total pin count and associated power consumption in the controller.
4Area of stationary object
If the sequencer component is separated from the controller and integrated within the same package as memory components, then the form factor is reduced and signal integrity is enhanced, but the device complexity increases
Solution Approach 1:
The patent merges the sequencer component with the memory component package, creating an integrated memory sub-assembly. This merging reduces the overall form factor by eliminating separate components and interconnections, while the standardized interface with the controller keeps the added complexity manageable.
Solution Approach 2:
The sequencer component is designed as a universal interface that can work with multiple types of memory components within its package. This multi-functionality approach standardizes the integration process and reduces complexity by using a common sequencer design that can accommodate different memory technologies and configurations.
Data Source
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AI summary
An instruction can be received at a sequencer from a controller. The sequencer can be in a package including the sequencer and one or more memory components. The sequencer is operatively coupled to a controller that is separate from the package. A processing device of the sequencer can perform an operation based on the instruction on at least one of the one or more memory components in the package.