In-Package Transformer Power Delivery for High-Current Semiconductor Dies
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Solution Overview
Problem
Large semiconductor devices require high current at low voltages, posing challenges for packaging technologies in terms of power, thermal, and signal management.
Innovation Solution
A method and apparatus for supplying power to semiconductor chips using a driver circuit outside the semiconductor package and output circuits within the package, featuring a power transformer and rectification circuit to provide DC power, along with a power bus to carry AC power and a magnetically permeable core for efficient power conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high current at low voltage is supplied to large semiconductor devices, then the semiconductor devices can operate with required power, but packaging technologies face challenges in accommodating power, thermal, and signal demands
Solution Approach 1:
The power delivery system is segmented into multiple functional blocks distributed across separate semiconductor dies: a first power conversion block on a first die performs voltage-to-current conversion, a second power conversion block on a second die performs additional power conversion, and these blocks are interconnected through conductive vias and traces on the substrate. This segmentation allows each die to specialize in specific power conversion functions, reducing the complexity of integrating all functions in a single package while maintaining high power delivery capability.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking multiple semiconductor dies above and below the substrate, with conductive vias providing vertical interconnections. This three-dimensional power delivery architecture allows power conversion blocks to be positioned in multiple layers, increasing power delivery capacity without expanding the horizontal package footprint, thus resolving the contradiction between power capability and packaging complexity.
2Loss of energy
If power conversion blocks are integrated within the semiconductor package, then power delivery efficiency is improved, but the package size and thermal management requirements increase
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for mounting semiconductor dies, establishes electrical connections between dies through conductive traces and vias, and facilitates thermal management pathways. This multi-functionality allows the package to achieve high power delivery efficiency through integrated power conversion blocks without proportionally increasing package area, as the same structural elements serve multiple purposes.
3Productivity
If multiple power conversion blocks are used to deliver high current, then the required current capability is achieved, but the number of components and interconnections increases
Solution Approach 1:
Multiple power conversion blocks are merged into a unified power delivery system through the substrate interconnection network. The first and second power conversion blocks on different dies are electrically combined via conductive vias and traces, creating an integrated high-current delivery capability. This merging approach achieves high productivity in current delivery while reducing the effective component count by integrating multiple blocks into a cohesive system rather than treating them as separate discrete components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient power supply to large semiconductor devices by reducing space and thermal dissipation requirements, while maintaining high efficiency and low noise levels.
Implementation Method 1
a power transformer including a first winding and a second winding, an input connected to the first winding for receiving AC power
Implementation Method 2
a rectification circuit connected to the second winding for rectifying power received from the transformer
Implementation Method 3
featuring a power transformer and rectification circuit to provide DC power, along with a magnetically permeable core for efficient power conversion
Data Source
AI summary
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.