In-Plane Backup Bypass Connections for Touch Sensor Panels
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Solution Overview
Problem
Touch sensor panels are prone to failures due to connection defects, particularly in the manufacturing process, which leads to decreased productivity and increased costs.
Innovation Solution
Incorporating in-plane backup bypass connections formed from the same material as the electrode arrays, these connections provide reliable signal pathways in case of open circuit failures, mitigating the risk of defects in out-of-plane series connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If out-of-plane bridging traces are used to connect row and column traces, then electrical connections can be established between crossing traces, but the complexity of the manufacturing process increases and defect probability increases
Solution Approach 1:
The patent extracts the connection function from the complex out-of-plane bridging traces and relocates it to in-plane cross connects that are formed simultaneously with the electrode arrays. This separates the connection function into the same manufacturing step, eliminating the need for subsequent bridging trace deposition and reducing overall process complexity.
Solution Approach 2:
The in-plane cross connects are formed in advance during the same manufacturing process as the electrode arrays, before any out-of-plane bridging traces would be added. This preliminary action ensures that the basic connection infrastructure is already in place and reduces the number of subsequent manufacturing steps required.
2Ease of manufacture
If additional out-of-plane bridging traces are deposited to create connections, then trace intersections can be connected, but the number of manufacturing steps increases and defect opportunities increase
Solution Approach 1:
The patent merges the formation of cross connects with the formation of electrode arrays into a single manufacturing step. Both structures are created simultaneously in the same process, eliminating the need for separate deposition and patterning steps for the connections, thereby simplifying manufacturing and reducing defect opportunities.
Solution Approach 2:
The in-plane cross connects serve multiple functions: they provide electrical connections between traces, act as backup bypass paths for defect mitigation, and are formed using the same manufacturing process as the electrode arrays. This multi-functionality reduces the need for additional specialized manufacturing steps.
3Productivity
If in-plane cross connects are formed from the same material as electrode arrays, then manufacturing complexity is reduced and yield increases, but the structural differentiation between electrodes and connections is reduced
Solution Approach 1:
While using the same material, the patent differentiates cross connects from electrode arrays through parameter changes such as trace width, trace geometry, and spatial arrangement. These parameter variations maintain material uniformity (simplifying manufacturing) while preserving functional and structural differentiation between electrodes and connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of in-plane cross connects significantly reduces the probability of panel failure, ensuring reliable operation and increasing manufacturing yield by providing backup signal pathways.
Implementation Method 1
conductive bridges extending between adjacent diamond shaped areas
Implementation Method 2
an insulating material layer overlying the diamond shaped areas and the in-plane series connections
Data Source
AI summary
Touch sensor panels (104) have 2-D periodic arrangements of electrodes (304) connected together forming a plurality of horizontal and vertical logical lines (506, 514) for measuring X-Y coordinates of a user's touch. Electrodes forming the horizontal logical lines are interleaved with electrodes forming the vertical logical lines. Each of the vertical and horizontal logical lines includes multiple tracks (502, 504, 510, 512). The tracks of each logical line are cross connected by in-plane cross connects (314, 318) formed in the same layer by the same process that is used to form the electrodes. Diamond and square electrode embodiments are described.