In-Plane Distortion Mapping for 3D NAND Process Diagnosis
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Solution Overview
Problem
In-plane distortion (IPD) in 3D NAND memory fabrication leads to poor performance due to non-uniform energy distribution and gas flow, making it challenging to identify and optimize areas for improvement using existing methods like three-sigma values, which fail to provide specific insights into hardware or process issues.
Innovation Solution
The system generates assessment maps, including planar, radial, and residue maps, by processing vector maps to decompose IPD, indicating distortions caused by hardware asymmetry, tensile and compressive stresses, and localized defects, allowing for optimization of manufacturing processes and equipment configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If three-sigma values are used to measure IPD, then a quantitative metric is obtained, but specific insights into hardware or process issues are not provided
Solution Approach 1:
The patent segments the overall IPD measurement into three distinct components: planar component (indicating hardware asymmetry), radial component (indicating stress/strain), and residue component (indicating localized defects). This segmentation allows each type of distortion to be analyzed separately, providing specific diagnostic information about hardware or process issues while maintaining quantitative measurement precision.
2Reliability
If manufacturing processes are optimized to reduce IPD, then product performance improves, but energy consumption and resource usage increase
Solution Approach 1:
The patent applies local quality by identifying specific locations and types of IPD distortions through the three-component decomposition. Instead of applying uniform manufacturing optimizations across the entire substrate, the system targets specific areas with planar, radial, or residue components, allowing for localized process adjustments that reduce energy consumption while maintaining product performance.
3Manufacturing precision
If manufacturing equipment is configured to improve IPD uniformity, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent introduces an intermediary assessment map system that decomposes IPD into three components. This intermediary layer between the manufacturing equipment and the final product allows for simplified equipment configuration adjustments. Instead of directly controlling complex equipment parameters, operators can use the assessment maps to identify which component (planar, radial, or residue) needs adjustment and make targeted, simpler modifications.
Data Source
AI summary
Methods and systems are described for generating assessment maps. A method includes receiving a first vector map comprising a first set of vectors each indicating a distortion of a particular location on a substrate and generating a second vector map indicating a change in direction of a magnitude of the distortion of the particular location on the substrate. The method further includes generating a third vector map comprising vectors reflecting reduced noise in distortions across the plurality of locations on the substrate and generating a fourth vector map projecting a direction component of each vector component in the third set of vectors to a radial direction. The method further includes generating a fifth vector map by grouping the vectors of the fourth set of vectors and determining a magnitude associated with each group of vectors.