In-Plane Photonic Device Waveguide Gap Isolation
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Solution Overview
Problem
Conventional methods for integrating electrical connections and photonic waveguides in photonic circuits are complex, costly, and not scalable, lacking efficient electrical isolation and mechanical/thermal stability, especially for electro-photonic devices.
Innovation Solution
An in-plane photonic device with optical waveguides separated by an electrical, thermal, and mechanical isolation gap, allowing electrical connections to be made on the chip-scale using mode matching and lensing features to maintain high optical signal transmission and low reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods (vias, wire bonding) are used to connect electrical components, then electrical connections can be established, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent merges electrical connections and photonic waveguides into a single planar layer, eliminating the need for separate via formation and wire bonding processes. This integration reduces manufacturing steps while maintaining functional connectivity between electrical components and optical pathways.
Solution Approach 2:
The invention extracts the connection function from traditional 3D structures (vias extending through substrate, wire bonds connecting separate layers) and reimagines it as a 2D planar configuration where electrical traces and waveguides coexist in the same plane without vertical penetration.
2Adaptability or versatility
If electrical connections are made through deep etched holes (vias), then out-of-plane connections are achieved, but production complexity and cost increase
Solution Approach 1:
The patent transitions from 3D vertical connections (via holes penetrating through substrate layers) to 2D planar connections where electrical traces and photonic waveguides interact within the same plane. This dimensional reduction simplifies fabrication by eliminating deep etching and multi-layer alignment requirements.
3Reliability
If wire bonding is used to connect contacts, then electrical isolation is achieved, but production time and cost increase
Solution Approach 1:
The patent combines electrical isolation functions with the primary connection structure by designing planar configurations where electrical traces naturally isolate regions without requiring additional wire bonding steps. The planar geometry itself provides the isolation mechanism through controlled trace routing and spacing.
4Reliability
If contacts are placed at the center of the chip for electrical isolation, then isolated regions can be contacted, but chip packaging becomes cumbersome
Solution Approach 1:
The patent segments the chip into electrically isolated regions using planar trace routing that creates natural boundaries. These segmented regions can be independently contacted at their perimeters rather than requiring central contacts, simplifying packaging by allowing edge-mounted connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, low-cost, and scalable production of integrated photonic circuits with high optical signal transmission (>90%) and low reflection (<10%), while providing electrical isolation and mechanical/thermal stability.
Implementation Method 1
the input and the output optical waveguides are configured for optical mode matching across the gap, such that an optical signal can be transmitted from the one or more input optical waveguides to the one or more output optical waveguide across the gap
Implementation Method 2
a gap between them electrically isolates the input and the output optical waveguides
Data Source
Figure 1A~1B
Figure 1C~2A
Figure 2B~2C
AI summary
The present disclosure relates to an in-plane photonic device for transmission of an optical signal across a gap, in particular an in-plane photonic device that is suitable for use in a photonic integrated circuit with one or more in-plane crossings of electrical connections and photonic waveguides. One embodiment relates to an in-plane photonic device for use in a photonic integrated circuit with in-plane crossings of electrical connections and photonic waveguides, comprising: at least one input optical waveguide; and at least one output optical waveguide; wherein the at least one input optical waveguide and the at least one output optical waveguides are positioned such that a gap between them separates the input and the output optical waveguide(s), and wherein the input and the output optical waveguides are configured for optical mode matching across the gap, such that an optical signal can be transmitted from the input optical waveguide to the output optical waveguide across the gap.