In-Rack Two-Phase Cooling Unit for High-Density Datacenter Heat
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Solution Overview
Problem
Datacenter cooling systems face challenges in efficiently managing varying cooling requirements due to changing computing loads, particularly in high heat density environments where traditional air-cooling methods are insufficient, and refrigerant-based systems require external pumps and condensing units, limiting their application.
Innovation Solution
The implementation of an intelligent in-rack pump or compressor unit that uses a two-phase refrigerant or engineered fluid, such as Novec 7000, R1234Ze, or R134a, with a cold plate and pump/compressor unit for heat removal from computing devices, allowing for localized and efficient cooling within the datacenter without the need for external condensing units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air-cooling methods are used, then the cooling system is simple to implement, but they are insufficient for high heat density environments
Solution Approach 1:
The patent utilizes phase change of refrigerant (evaporation and condensation) to achieve efficient heat transfer. The refrigerant evaporates at the evaporator to absorb heat from high-density components, then condenses at the condenser to release heat, providing superior cooling capacity compared to air-cooling methods.
Solution Approach 2:
The patent integrates the compressor, evaporator, and condenser into a compact modular unit that can be placed within or adjacent to server racks. This nested arrangement allows the refrigeration system to be embedded within the datacenter infrastructure, reducing space requirements while maintaining high cooling capacity.
2Temperature
If refrigerant-based systems are used, then cooling capacity is improved, but external pumps and condensing units are required
Solution Approach 1:
The patent combines the compressor, evaporator, and condenser into an integrated modular unit. This merging of components eliminates the need for separate external pumps and condensing units, as all essential refrigeration functions are contained within a single self-contained system that can be positioned close to the heat source.
Solution Approach 2:
The patent divides the datacenter cooling load into multiple independent modular units, each capable of handling local heat generation. This segmentation allows each module to operate autonomously with its own compressor and heat exchange components, eliminating the need for centralized external infrastructure.
3Productivity
If high heat density components are cooled, then computing performance is improved, but more cooling infrastructure is needed
Solution Approach 1:
The patent implements localized cooling units that are positioned directly at or near high heat density components such as GPU racks and switching equipment. Each local unit provides targeted cooling to specific heat-generating areas, delivering the necessary cooling capacity without requiring infrastructure throughout the entire datacenter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat management for high heat density components like GPUs, CPUs, and switches by using a two-phase fluid that transforms between liquid and vapor phases, enhancing cooling capacity and reducing the need for external infrastructure, thus providing a more economical and efficient cooling solution.
Implementation Method 1
using a two-phase refrigerant or engineered fluid, such as Novec 7000, R1234Ze, or R134a
Implementation Method 2
uses a two-phase refrigerant or engineered fluid
Implementation Method 3
with a cold plate and pump/compressor unit for heat removal from computing devices
Implementation Method 4
pump or compressor unit that uses a two-phase refrigerant or engineered fluid
Implementation Method 5
The cooled coolant is recirculated back into the datacenter
Data Source
AI summary
Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.