In-Situ Substrate Metrology for Transfer-Free Process Control
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Solution Overview
Problem
Conventional metrology methods for substrate fabrication require transferring processed substrates from processing chambers to standalone apparatuses, leading to time-consuming processes and potential oxidation issues during transfer.
Innovation Solution
An integrated metrology apparatus within a substrate processing platform, featuring an interferometer, sensor, and actuator, allows for in-situ measurements of substrates during processing, minimizing vacuum breaks and contamination by positioning these components along a measurement plane parallel to the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If substrate is transferred from processing chamber to standalone metrology apparatus, then metrology measurement can be performed, but time is consumed and oxidation can develop on substrate
Solution Approach 1:
The patent merges the metrology apparatus with the substrate processing chamber into an integrated system. The interferometer and sensor components are positioned within the processing chamber environment, allowing metrology measurements to be performed on substrates without removing them from the chamber. This eliminates the transfer step entirely, resolving the contradiction between achieving measurement and avoiding time loss and oxidation.
2Measurement precision
If substrate is transferred from processing chamber to standalone metrology apparatus, then metrology measurement can be performed, but oxidation develops on substrate
Solution Approach 1:
The patent merges the metrology apparatus with the substrate processing chamber into an integrated system. The interferometer and sensor components are positioned within the processing chamber environment, allowing metrology measurements to be performed on substrates without removing them from the chamber. This eliminates the transfer step entirely, resolving the contradiction between achieving measurement and avoiding time loss and oxidation.
3Loss of information
If multiple measurement points are obtained along substrate surface, then comprehensive metrology data is collected, but measurement complexity increases
Solution Approach 1:
The patent employs dynamic positioning of the interferometer and sensor components along the substrate surface. The actuator system enables these components to move to various positions and orientations, allowing comprehensive data collection from multiple measurement points. This dynamic capability provides complete metrology information while keeping the physical system relatively simple through controlled movement rather than having fixed sensors at every possible measurement location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, contamination-reduced metrology data collection for both pre- and post-processed substrates, improving process control and reducing oxidation risks by integrating measurement capabilities within the processing chamber.
Implementation Method 1
an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate
Data Source
AI summary
Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.